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MCZ33810EK is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC IGNITION INJECTOR 32-SOIC. Review the specifications below when checking this part for your BOM.
The MCZ33810EK is an automotive engine control integrated circuit from NXP Semiconductors, designed for powertrain applications. It features four low-side drivers and four pre-drivers with SPI interface support for Electronic Fuel Injection (EFI). The device operates within a supply voltage range of 4.5 V to 36 V and handles output currents up to 2 mA per channel. It functions reliably across a temperature range of -40°C to +125°C. Packaged in a SOIC-Wide-32 surface-mount format, the IC dissipates up to 1.7 W of power and includes humidity sensitivity considerations for manufacturing processes.
Verify component authenticity through authorized NXP channels due to end-of-life status. Confirm package integrity and moisture sensitivity level handling requirements during assembly. Ensure design compatibility with SPI protocols and low-side driver configurations before integration into final engine control hardware.
Select this component for applications requiring dedicated low-side switching capabilities within strict automotive thermal limits. The SOIC-Wide-32 package facilitates surface-mount assembly while providing adequate thermal dissipation for continuous operation. Consider the specific current requirements of connected actuators against the 2 mA output specification.
Part of the MC33810 series focusing on automotive engine control solutions. Complements other NXP powertrain components like the MC33800 series by offering specialized low-side driver configurations tailored for fuel injection and ignition timing control in modern vehicle architectures.
The manufacturer indicates the product is approaching end-of-life. Verify official replacement part numbers or alternative series components that maintain pinout and functional compatibility for continued production runs.
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