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Product Detailed Parameters
- Description：IC MTR DRV BIPLR 4.5-5.5V 24SOIC
- Series：-
- Mfr：NXP USA Inc.
- Package：Tape & Reel (TR)
- Motor Type - Stepper：Bipolar
- Motor Type - AC, DC：-
- Function：Driver - Fully Integrated, Control and Power Stage
- Output Configuration：Half Bridge (8)
- Interface：SPI
- Technology：-
- Step Resolution：-
- Applications：-
- Current - Output：40mA
- Voltage - Supply：4.5V ~ 5.5V
- Voltage - Load：6.5V ~ 26V
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Surface Mount
- Package / Case：24-SOIC (0.295", 7.50mm Width)
- Supplier Device Package：24-SOIC
- Grade：Automotive
- Qualification：-
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Overview
The MCZ33970EGR2 is a System Basis Chip (SBC) manufactured by NXP USA Inc., designed for automotive applications. It integrates a high-speed CAN transceiver, a dual LIN transceiver, and a power management unit with voltage regulators. The device supports HSCAN and DUAL LIN interfaces, providing robust communication capabilities. It operates within an extended temperature range of -40°C to +125°C and is housed in a 54-pin HSSOP package. The component features integrated protection mechanisms and diagnostic functions suitable for complex automotive electronic control units.
Feature Summary
- Integrates high-speed CAN and dual LIN transceivers for multi-network communication
- Includes power management unit with multiple voltage regulators
- Provides comprehensive diagnostic and protection features for system reliability
Applications
- Automotive body control modules
- Gateway electronic control units
- Instrument cluster systems
Procurement Notes
Verify the specific suffix EGR2 against the official NXP datasheet to confirm package type and tape-and-reel specifications. Ensure compatibility with target vehicle network protocols. Check for RoHS compliance status as indicated in the latest product documentation. Confirm lead times and availability through authorized distributors only.
Selection Notes
Select this SBC when simultaneous high-speed CAN and dual LIN connectivity is required in a single package. Consider its integrated power management capabilities for reducing external component count. Evaluate its diagnostic features against functional safety requirements. Compare pinout and thermal performance with alternative SBCs for direct replacement scenarios.
Part Context
This component belongs to NXP's MCZ series of System Basis Chips, which are tailored for automotive electronics. These devices combine microcontroller support with essential interface and power management functions. The MCZ33970 variant specifically addresses needs for multi-protocol communication in body and gateway applications, offering a compact solution for modern vehicle architectures.
Replacement Considerations
Check for compatible alternatives such as the MCZ33905D5EKR2 or other MCZ series variants with similar CAN/LIN configurations. Verify pin-to-pin compatibility and electrical parameter alignment before substitution. Consult NXP documentation for any recommended upgrades or obsolescence notices.
