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MD1730T-V/M2 is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC ULTRASOUND IMAGING 36VQFN. Review the specifications below when checking this part for your BOM.
The MD1730T-V/M2 is an 8-channel ultra-low phase noise continuous waveform transmitter manufactured by Microchip Technology. It integrates a beamformer delay generator and supports five transmission levels. The device is housed in a 36-pin SQFN (VQFN) package with exposed pad, designed for surface-mount installation. It operates within the RF transmitter category and utilizes Silicon technology. The component is RoHS compliant and exhibits moisture sensitivity. This integrated circuit is engineered for high-performance radio frequency signal generation in specialized imaging systems.
Verify the specific suffix 'T' indicates tape-and-reel packaging configuration when sourcing. Confirm the 'V' temperature grade aligns with operational environmental requirements. Ensure compatibility with the 36-pin SQFN footprint during PCB layout. Cross-reference the datasheet revision to confirm pinout consistency. Validate RoHS compliance documentation for regulatory adherence.
Select this component when an integrated solution for multi-channel ultrasound transmission is required. The built-in beamformer delays simplify system architecture by reducing external logic needs. Consider the SQFN package size for compact board designs. Evaluate the thermal performance of the exposed pad for heat dissipation. Compare against discrete transmitter solutions for integration density advantages.
This part belongs to the MD1730 series of RF transmitters from Microchip Technology. The series focuses on providing integrated solutions for medical imaging applications. Variants such as the MD1730-V/M2 share core functionalities but may differ in packaging or temperature ratings. The T suffix typically denotes reel packaging, distinguishing it from tray-packaged equivalents.
The MD1730-V/M2 serves as a direct functional substitute if packaging differences are acceptable. Verify pin-to-pin compatibility before substitution. Check temperature range specifications to ensure environmental suitability. Confirm that the beamformer delay configurations remain compatible with existing system designs.
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