MD1813K6-G

Overview

The MD1813K6-G is a high-speed quad MOSFET gate driver manufactured by Microchip Technology. It features four independent drivers in a 16-pin QFN package. The device supports a supply voltage range of 4.5V to 18V and delivers a peak output current of 2A. Electrical characteristics include a rise time and fall time of 6ns. It is designed for applications requiring fast switching speeds and robust drive capabilities.

Feature Summary

• High-speed operation with 6ns rise and fall times
• Quad channel configuration for multi-phase applications
• Capable of sourcing and sinking 2A peak output current
• CMOS compatible input logic

Applications

• Isolated power supplies
• Motor control systems
• Inverter circuits

Procurement Notes

Verify component authenticity through authorized Microchip distributors or certified partners. Confirm the specific suffix 'G' indicates lead-free compliance as per RoHS standards. Check for obsolescence status, as availability may be limited. Ensure storage conditions meet manufacturer specifications to maintain device integrity prior to assembly.

Selection Notes

Select this component when a quad-channel driver with high peak current capability is required. The 6ns propagation delay suits high-frequency switching applications. Verify that the 4.5V minimum supply voltage aligns with the system's power rail. Consider the 16-QFN package constraints for thermal management and PCB layout requirements during the design phase.

Part Context

This part belongs to Microchip's MD18xx series of high-speed MOSFET gate drivers. The series is engineered for compact, isolated power conversion topologies. The MD1813 variant specifically provides non-inverting outputs for all four channels, distinguishing it from mixed-inversion counterparts within the same family.

Replacement Considerations

Consult official Microchip documentation for qualified pin-to-pin replacements. Cross-reference electrical parameters such as peak current and propagation delay to ensure compatibility. Verify package dimensions match the existing footprint before substitution.