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MD8832-D1G-V18-X-P is listed in the Memory IC range at ChipApex. The manufacturer field lists SanDisk. Its product description is IC FLASH 1GBIT PARALLEL 69FBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for MD8832-D1G-V18-X-P
- Description：IC FLASH 1GBIT PARALLEL 69FBGA
- Series：-
- Mfr：SanDisk
- Package：Tape & Reel (TR),Cut Tape (CT)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND
- Memory Size：1Gbit
- Memory Organization：128M x 8
- Memory Interface：Parallel
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.65V ~ 1.95V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：69-FBGA
- Supplier Device Package：69-FBGA (9x12)
- Access Time：30 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for MD8832-D1G-V18-X-P
Memory IC Overview
The SanDisk MD8832-D1G-V18-X-P is a 1Gbit (128M x 8) parallel NAND flash memory integrated circuit. It features a 69-FBGA package with dimensions of 9x12 mm. The device operates within a voltage range of 1.65V to 1.95V and supports an access time of 30 ns. It is designed for industrial temperature ranges, functioning between -40°C and +85°C.
Memory IC Feature Summary
- Parallel interface architecture for direct data bus connectivity
- Non-volatile storage technology retaining data without power
- Industrial-grade thermal stability for extreme environments
Memory IC Applications
- Embedded systems requiring robust non-volatile storage
- Industrial control units operating in harsh conditions
- Automotive electronics demanding wide temperature tolerance
Memory IC Procurement Notes
Verify the specific voltage variant (1.8V) matches your system requirements. Confirm the 69-FBGA footprint compatibility during PCB layout. Ensure ESD protection protocols are followed due to the sensitive nature of NAND flash components. Check for RoHS compliance documentation if required by your manufacturing standards.
Memory IC Selection Notes
Select this component when a parallel interface is preferred over SPI or eMMC for higher throughput needs. Consider the 1.8V supply requirement carefully against available power rails. The industrial temperature rating makes it suitable for applications where standard commercial grade parts would fail. Evaluate the 1Gbit capacity against total storage demands.
Memory IC Part Context
This part belongs to SanDisk's NAND flash memory portfolio, specifically designed for embedded applications. It utilizes TLC or similar cell technologies common in high-density storage solutions. The parallel interface allows for faster data transfer rates compared to serial alternatives, making it ideal for performance-critical embedded designs.
Memory IC Replacement Considerations
Direct substitutes must match the 1Gbit density, parallel interface, and 69-FBGA package. Verify voltage compatibility at 1.8V. Industrial temperature range (-40°C to +85°C) is critical for equivalent replacement. Consult manufacturer cross-reference lists for pin-compatible alternatives.
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