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The IXYS MDD310-16N1 is a high-power diode module featuring two planar passivated silicon chips in a Y2-DCB package. It provides a maximum repetitive reverse voltage (VRRM) of 1600 V and a maximum average forward current (IFAVM) of 305 A per diode at a case temperature of 100°C. The module utilizes a direct copper bonded Al2O3 ceramic base plate for thermal management and offers an isolation voltage of 3600 Vrms. With a typical weight of 320 g, it supports screw mounting with specified torques for terminals and mounting hardware.
Verify the specific part number against official IXYS documentation to confirm electrical ratings and physical dimensions. Ensure that the required isolation voltage and thermal characteristics align with the system design specifications before procurement. Confirm compliance with relevant safety standards such as UL registration E72873.
Select this module based on its 1600 V reverse voltage rating and 305 A average forward current capability per diode. Consider the thermal resistance values and the need for appropriate heatsinking to maintain junction temperatures within the specified operating range. Evaluate the mechanical requirements for screw mounting and terminal connections.
The MDD310-16N1 belongs to the MDD310 series of high-power diode modules manufactured by IXYS. This series is designed for demanding power electronics applications requiring robust performance and reliability. The module integrates two diodes in a single compact package, facilitating efficient space utilization in power conversion systems.
MDD310-14N1, MDD310-18N1