ME-AA1-270-3E4-D11E-R2

Overview

The Enclustra ME-AA1-270-3E4-D11E-R2 is a Mercury+ AA1 System-on-Chip module integrating an Intel Arria 10 SoC (10AS027) with a dual-core ARM Cortex-A9 processor and a 20nm FPGA fabric. It features up to 2GB of DDR4 SDRAM with ECC, 64MB Quad SPI flash, and 16GB eMMC flash. The module supports PCIe Gen3 x8, Gigabit Ethernet, USB 2.0, and multi-gigabit transceivers operating at 10.3125 Gbit/sec. Designed for industrial applications, it operates within a temperature range of 0°C to +85°C and accepts a supply voltage between 5V and 15V.

Feature Summary

• Intel Arria 10 SoC with dual-core ARM Cortex-A9 and 20nm FPGA fabric
• Up to 2GB DDR4 SDRAM with Error Correction Code (ECC)
• PCIe Gen3 x8 interface and 12 Multi-Gigabit Transceivers (MGTs)
• Industrial temperature range support (0°C to +85°C)

Applications

• Rapid prototyping for embedded processing systems
• High-speed communication and video applications
• Software-defined radio implementations

Procurement Notes

Verify the specific hardware revision against the product model, as revisions prior to R2.01 include a Cypress FX3 USB 3.0 controller which is no longer standard in later versions. Confirm that the ordering suffix matches the required memory capacity and temperature grade. Ensure baseboard connectors align with the Hirose FX10 series specifications to prevent mechanical damage during installation.

Selection Notes

Select this module when an integrated ARM processor and FPGA fabric are required for complex signal processing. The 10AS027 device provides a balance of logic resources and processing power. Consider the 2GB DDR4 configuration for applications requiring significant data buffering. Verify compatibility with the Enclustra Build Environment if Linux deployment is planned.

Part Context

This component belongs to the Mercury+ AA1 family, designed to simplify system design by combining high-performance components into a compact form factor. It serves as a complete embedded processing solution, reducing development effort compared to custom SoC hardware designs. The module is intended for use with compatible Enclustra baseboards such as the PE1, PE3, or ST1.

Replacement Considerations

Modules with different ordering suffixes may vary in memory size, temperature rating, or the presence of the FX3 chip. For example, the -NFX3 suffix indicates the absence of the FX3 controller. Ensure any replacement matches the specific SoC variant (10AS027 vs 10AS048) and memory configuration required by the application.