SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Enclustra ME-KX2-160-2I-D11-P-R2.3 is a Mercury+ KX2 FPGA module integrating the Xilinx XC7K160T-2FFG676I device in an FFG676 package. It operates within an industrial temperature range of -40 to +85°C and includes 2GB of DDR3 SDRAM. The module provides 216 user I/Os, eight multi-gigabit transceivers (MGTs) supporting up to 10.3125 Gbit/sec, and dual Gigabit Ethernet PHYs. Configuration is supported via on-board QSPI flash, JTAG, or an integrated FTDI USB 2.0 controller. Power is supplied through a single 5V to 15V DC input, generating internal voltages for the FPGA and peripherals.
Verify the article number EN101776 corresponds to the R2.3 hardware revision. Confirm that the specific product code ME-KX2-160-2I-D11-P matches the required 2GB DDR3 configuration and industrial temperature grade. Ensure compatibility with the intended Mercury+ base board connector types.
Select this module when the XC7K160T logic density is sufficient for the design. The FFG676 package supports higher MGT speeds compared to FBG variants. Verify that the host system can provide the required 5-15V input voltage and that the base board accommodates the 74x54mm footprint and Hirose FX10 connectors.
This module belongs to the Mercury+ KX2 family, which pairs Xilinx Kintex-7 devices with standard peripheral interfaces. It is designed for rapid prototyping and deployment alongside Mercury+ base boards like the PE1 series. The R2.3 suffix indicates a specific hardware revision documented in the Known Issues and Changes guide.
Direct replacements include other ME-KX2 variants such as ME-KX2-325-2I-D11-P or ME-KX2-410-2I-D11-P for higher logic capacity. Lower density options like ME-KX2-160-1C-D10 are available but differ in package type and temperature range.