Microcontrollers, Microprocessor, FPGA Modules ME-XU8-7EV-2I-D12E-R2.2 product image

ME-XU8-7EV-2I-D12E-R2.2

  • Description:SOM ZYNQ XU8 US+ ZU7EV
  • Series:-

SKU:64321342a1c2 Category: Brand:

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ME-XU8-7EV-2I-D12E-R2.2 is listed in the Microcontrollers, Microprocessor, FPGA Modules range at ChipApex. The manufacturer field lists Enclustra FPGA Solutions. Its product description is SOM ZYNQ XU8 US+ ZU7EV. Review the specifications below when checking this part for your BOM.

Microcontrollers, Microprocessor, FPGA Modules specifications for ME-XU8-7EV-2I-D12E-R2.2

  • Description:SOM ZYNQ XU8 US+ ZU7EV
  • Series:-
  • Mfr:Enclustra FPGA Solutions
  • Package:Bulk
  • Module/Board Type:MPU, FPGA Core
  • Core Processor:ARM® Cortex®-A53, ARM® Cortex®-R5
  • Co-Processor:-
  • Speed:533MHz, 1.333GHz
  • Flash Size:16GB
  • RAM Size:4GB
  • Connector Type:168 Pin
  • Size / Dimension:2.910" L x 2.130" W (74.00mm x 54.00mm)
  • Operating Temperature:-40°C ~ 85°C

Microcontrollers, Microprocessor, FPGA Modules datasheet and documents for ME-XU8-7EV-2I-D12E-R2.2

ME-XU8-7EV-2I-D12E-R2.2

Microcontrollers, Microprocessor, FPGA Modules Overview

The ME-XU8-7EV-2I-D12E-R2.2 is a System-on-Module (SoM) from Enclustra FPGA Solutions, part of the Mercury+ family. It integrates an AMD Xilinx UltraScale+ XCZU9EG-2FFVB1156E SoC. The module features a dual-core ARM Cortex-A9 processor and substantial programmable logic resources. It includes 4GB of LPDDR3 memory and 2GB of QSPI flash. Designed for industrial environments, it operates within a temperature range of -40°C to +85°C. The module utilizes a 168-pin connector interface for carrier board integration.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

  • Integrates AMD Xilinx UltraScale+ XCZU9EG-2FFVB1156E SoC with Kintex UltraScale+ fabric
  • Includes dual-core ARM Cortex-A9 MPCore processor running at 800MHz
  • Equipped with 4GB LPDDR3 SDRAM and 2GB QSPI Flash memory
  • Supports industrial operating temperatures from -40°C to +85°C

Microcontrollers, Microprocessor, FPGA Modules Applications

  • Industrial automation and control systems
  • Medical imaging devices requiring high-performance processing
  • Aerospace and defense embedded computing platforms
  • Test and measurement equipment

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific revision suffix R2.2 against current manufacturer documentation to ensure compatibility with existing carrier designs. Confirm that the required memory configuration matches the standard 4GB LPDDR3 and 2GB QSPI layout. Check for any recent engineering change notices (ECNs) affecting pinout or power sequencing relative to earlier revisions in the ME-XU8 series.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when high-density I/O and significant DSP capabilities are required alongside embedded processing. The XCZU9EG device offers extensive block RAM and DSP slices suitable for complex signal processing. Ensure the carrier board supports the necessary power rails and thermal management for the UltraScale+ architecture under full load conditions.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This component belongs to the Enclustra Mercury+ family, which targets ruggedized and high-performance applications. It succeeds previous generations by offering improved performance per watt and higher memory bandwidth. The ME-XU8 variant specifically addresses needs for large-scale logic implementation and heavy data throughput compared to smaller form-factor modules.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Direct replacement requires matching the 168-pin footprint and electrical characteristics. Verify if newer revisions like R2.3 or R2.4 offer backward-compatible pinouts. Consider upgrading to the ME-XU8-7EV-2I-D12E-R3.x series if enhanced feature sets are available without mechanical changes.

ME-XU8-7EV-2I-D12E-R2.2ME-XU8-7EV-2I-D12E-R2.2

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