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ME-ZX1-35-1I-D10-R3 is listed in the Microcontrollers, Microprocessor, FPGA Modules range at ChipApex. The manufacturer field lists Enclustra FPGA Solutions. Its product description is SOM ZYNQ 7Z035 1GB+0.25GB PL. Review the specifications below when checking this part for your BOM.
The Enclustra ME-ZX1-35-1I-D10-R3 is a System-on-Module (SoM) based on the AMD Zynq XC7Z035-1FBG676I All Programmable SoC. It integrates an ARM Cortex-A9 MPCore processing system with a Kintex-7 FPGA fabric. The module provides 1GB of DDR3 SDRAM for the PS and 256MB for the PL, alongside 64MB Quad SPI flash and 512MB NAND flash. Key interfaces include Gigabit Ethernet, dual Fast Ethernet, USB 2.0 OTG, PCIe Gen2 x4/x8, and up to 40 Multi-Gigabit Transceivers (MGTs). Designed for industrial environments, it operates within a temperature range of -40°C to +85°C.
Verify the specific revision suffix '-R3' against the manufacturer's EN-number list to ensure hardware compatibility with baseboards. Confirm that the required Vivado ML Enterprise Edition license is available, as this model exceeds the capacity for free WebPACK tools. Ensure the baseboard design accommodates the 64x54mm footprint and mounting hole alignment.
Select this model over the ME-ZX1-30 variant if higher FPGA logic density or additional MGT transceivers are required. The '1' in the part number indicates a speed grade of -1, suitable for standard frequency requirements. Verify that the 5-15V input voltage range matches the power supply design of the target carrier board.
This module belongs to the Mercury ZX1 family, which utilizes the AMD Zynq-7000 series. It is designed to be pin-compatible with other modules in the Mercury series, allowing for scalability during product development. The module serves as a complete embedded processing system, reducing the complexity of designing custom SoC hardware from scratch.
Publicly confirmed substitute part numbers are not provided in the source material. For upgrades within the same form factor, consider the ME-ZX1-45-2I-D10-P-R3 for increased performance. Cross-family replacements require re-evaluation of mechanical footprints and pin mappings.
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