MEA3216L25R0

Overview

The MEA3216L25R0 is a surface-mount multilayer EMI filter array manufactured by TDK Corporation. It features a monolithic L-type circuit design with four independent filter lines housed in a compact 3.2 mm x 1.6 mm x 0.85 mm package. The component provides a center cutoff frequency of 25 MHz and supports a maximum current of 100 mA. It operates within a temperature range of -40°C to +85°C and complies with RoHS directives.

Feature Summary

• Features an entirely monolithic structure that minimizes crosstalk between the four internal filter lines.
• Utilizes a unique 4-line multilayer L-type circuit configuration for efficient signal line filtering.
• Designed for tape packaging to facilitate automated assembly equipment integration.

Applications

• RGB and signal lines of data terminals
• Computing and communications devices
• Color liquid crystal displays

Procurement Notes

Verify availability status as this specific part number may be obsolete or discontinued. Confirm if direct substitutes like the MEA2010L50R0 are suitable replacements for your design requirements. Ensure compliance with current environmental regulations such as RoHS before finalizing procurement decisions.

Selection Notes

Select this component for applications requiring compact, multi-channel EMI suppression on general signal lines. The 1206 footprint allows for space-constrained designs while maintaining four distinct filtering paths. Consider the 25 MHz cutoff frequency to ensure effective attenuation for the target signal bandwidths without impacting desired data transmission rates.

Part Context

This component belongs to the TDK MEA series of 3-terminal SMD arrays designed for general signal line protection. These filters are engineered to suppress electromagnetic interference in digital circuits. The L-type designation indicates the specific internal circuit topology used to achieve the stated frequency characteristics.

Replacement Considerations

Public confirmed substitute: MEA2010L50R0T001. Verify compatibility regarding package dimensions and electrical specifications when substituting.