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MEB1-184SL83 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists ITT Cannon, LLC. Its product description is CONN EDGE DUAL FML 184POS 0.020. Review the specifications below when checking this part for your BOM.
The MEB1-184SL83 is a dual-face edgeboard connector manufactured by ITT Cannon, LLC. It features 184 positions designed for high-density signal transmission in electronic systems. The contacts are constructed from copper alloy and finished with gold plating to ensure reliable conductivity and corrosion resistance. The contact finish thickness is specified as 50.0µin (1.27µm). The insulation material utilized is diallyl phthalate (DAP) reinforced with glass fill, providing structural stability and thermal performance suitable for demanding industrial environments.
Verify the specific contact finish thickness requirement against the datasheet specification of 50.0µin (1.27µm). Confirm that the glass-filled DAP insulation material aligns with the thermal constraints of the target application. Ensure compatibility with the intended board thickness and mating connector specifications before finalizing procurement orders.
Select this component when a high-density dual-edge interface is required. The 184-position capacity supports complex signal routing. Consider the gold contact finish for applications prioritizing low contact resistance. Verify that the operating environment temperature range is compatible with the DAP insulation characteristics.
This part belongs to the MEB series of edgeboard connectors from ITT Cannon. The series is designed for applications requiring reliable connections between circuit boards and backplanes or chassis-mounted connectors. The model number indicates the specific position count and physical dimensions within the product family.
No officially confirmed substitute part numbers are available in public documentation. Cross-referencing requires matching the 184-position count, dual-face design, and specific contact finish thickness.
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