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MEC1609-PZV is listed in the Application Specific Microcontrollers range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC EMBEDDED CTLR 144TFBGA. Review the specifications below when checking this part for your BOM.
The MEC1609-PZV is a mixed-signal mobile embedded flash ARC EC/BC-Link/VLPC base component manufactured by Microchip Technology. It features an ARC-625D 32-bit microcontroller with 192 KB of embedded Flash and 16 KB of dual-ported SRAM. The device operates at 3.3V and supports ACPI compliance via an LPC interface. It includes an AHB memory-mapped SPI Flash Read Controller, three SMBus 2.0 host controllers, and PECI 2.0 support. The MEC1609-PZV is housed in a 144-pin TFBGA package and operates within the commercial temperature range of 0°C to +70°C.
Verify the specific suffix 'PZV' corresponds to the 144-pin TFBGA package configuration. Confirm that the commercial temperature rating (0°C to +70°C) meets the operational requirements of the target environment. Ensure compatibility with the required LPC and VLPC companion components for the intended system architecture.
Select the MEC1609i variant if industrial temperature operation (-40°C to +85°C) is required instead of the standard MEC1609. Consider the PZP package option if a 144-pin LFBGA form factor is preferred over the TFBGA. Verify that the system design accommodates the separate VBAT and VTR power planes necessary for standby functionality.
The MEC1609 serves as the base component in Microchip's multi-device advanced I/O controller architecture. It communicates with companion devices using BC-Link and VLPC protocols. This component acts as the central processing unit for system management, handling low-power states and hardware wake events defined by its wake interface.
No direct public substitute part numbers are documented in the provided datasheet.
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