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MF0ULH1101DUFV is listed in the Application Specific Microcontrollers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC MIFARE ULTRALIGHT EV1 FFC BUM. Review the specifications below when checking this part for your BOM.
The MF0ULH1101DUFV is a bare die contactless ticket IC from the MIFARE Ultralight EV1 family, designed for ISO/IEC 14443 Type-A environments. It features 640-bit total EEPROM memory with 384 bits of free user memory. The device operates at 13.56 MHz and includes a 50 pF on-chip resonance capacitor to support TFC.0 and TFC.1 ticket formats. Security features include a manufacturer-programmed 7-byte UID, 32-bit OTP area, three independent 24-bit one-way counters, ECC-based originality signature, and configurable password protection.
Verify the specific suffix 'V' against official NXP documentation to confirm its impact on electrical parameters or package specifications. Ensure compatibility with the target Proximity Coupling Device (PCD) configuration given the 50 pF input capacitance requirement for optimal performance.
Select this variant over standard versions when the application requires higher input capacitance (50 pF) to accommodate specific antenna geometries or reader configurations. Confirm that the 640-bit memory capacity meets the data storage requirements for the intended ticketing or loyalty application.
This component belongs to the MF0ULx1 series, succeeding the MIFARE Ultralight IC with full backward compatibility. The 'H' designation indicates the high input capacitance variant, while 'UF' specifies a bare die with 75 μm thickness and Au bumps. It serves as a counterpart to advanced families like MIFARE DESFire.
MF0UL1101DUF: Standard 17 pF capacitance version. MF0ULH1101DUD: High capacitance version with 120 μm die thickness.
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