Power Management - Specialized MFS2321BMBB2EPR2 product image

MFS2321BMBB2EPR2

$2.81
  • Description:MFS2321BMBB2EPR2
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:f8501e2738f8 Category: Brand:

  
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MFS2321BMBB2EPR2 is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is MFS2321BMBB2EPR2. Review the specifications below when checking this part for your BOM.

Power Management - Specialized specifications for MFS2321BMBB2EPR2

  • Description:MFS2321BMBB2EPR2
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Applications:System Basis Chip
  • Current - Supply:-
  • Voltage - Supply:5.5V ~ 40V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount, Wettable Flank
  • Package / Case:48-VFQFN Exposed Pad
  • Supplier Device Package:48-HVQFN (7x7)
  • Grade:-
  • Qualification:-

Power Management - Specialized datasheet and documents for MFS2321BMBB2EPR2

MFS2321BMBB2EPR2

Power Management - Specialized Overview

The MFS2321BMBB2EPR2 is a Safety System Basis Chip (SBC) from NXP Semiconductors, designed for automotive applications. It integrates power management and communication interfaces, supporting up to ASIL B safety levels. The device features one high-voltage buck converter and two high-voltage LDOs. It supports CAN FD and LIN protocols, with an integrated LIN PHY. Compatible MCUs include CYT2B, RH850F1K, S32K1, and S32K31x. Operating temperatures range from -40°C to +125°C in a QFN-EP-48 package.

Power Management - Specialized Feature Summary

  • Integrates a high-voltage buck converter and two high-voltage LDOs for efficient power distribution.
  • Supports CAN FD and LIN communication protocols with an integrated LIN physical layer interface.
  • Designed for functional safety compliance up to ASIL B standards.
  • Provides comprehensive diagnostics capabilities for system monitoring.

Power Management - Specialized Applications

  • Automotive electronic control units requiring ASIL B compliance
  • Systems utilizing S32K1 or S32K31x microcontrollers
  • Applications integrating CAN FD and LIN bus networks
  • Power management solutions for RH850F1K platforms

Power Management - Specialized Procurement Notes

Verify the specific ordering suffix EPR2 indicates reel packaging when sourcing. Confirm compatibility with target MCU families such as S32K1 or S32K31x prior to integration. Ensure design specifications meet the required ASIL B safety integrity level. Check datasheet for thermal performance within the -40°C to +125°C operating range. Validate pinout and package dimensions against the QFN-EP-48 specification.

Power Management - Specialized Selection Notes

Select this component for designs requiring integrated safety features and mixed-signal communication. It is suitable for applications needing both CAN FD and LIN connectivity. Consider the output current ratings of 100 mA and 150 mA for load requirements. Evaluate the need for ASIL B certification in the system architecture. Compare against other FS23 series variants if different power configurations are needed.

Power Management - Specialized Part Context

This part belongs to the FS23 family of Safety System Basis Chips from NXP Semiconductors. These devices are engineered to simplify automotive electronics by combining power management with robust communication interfaces. The family targets modern vehicle architectures demanding high reliability and functional safety standards.

Power Management - Specialized Replacement Considerations

Check NXP documentation for direct substitutes within the FS23 series. Verify pin-to-pin compatibility if replacing with similar SBC models. Ensure safety level and communication protocol support match the original design requirements.

MFS2321BMBB2EPR2MFS2321BMBB2EPR2
$2.81
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