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MFS2611AMBA0AD is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is AUTO SBC. Review the specifications below when checking this part for your BOM.
The MFS2611AMBA0AD is an automotive System Basis Chip (SBC) from the FS26 series, manufactured by NXP Semiconductors. It integrates power management and communication interfaces in a 48-LQFP Exposed Pad package. The device operates with an input voltage range of 2.5 V to 6.35 V and supports output voltages from 800 mV to 3.35 V. It features a maximum input current of 800 mA and a typical operating supply current of 15 mA. The component is rated for industrial temperatures between -40°C and +125°C.
Verify the specific suffix 'AMBA0AD' against the official NXP datasheet to confirm pinout and feature configuration. Ensure the 48-LQFP-EP package dimensions match the target PCB footprint. Confirm RoHS compliance status through the manufacturer's latest documentation before finalizing procurement specifications.
Select this component when an integrated SBC solution is required for automotive body electronics. The FS26 series offers combined power and communication capabilities. Verify that the 2.5 V to 6.35 V input range aligns with the vehicle's electrical system requirements. Consider the exposed pad thermal performance for the intended enclosure design.
This part belongs to the NXP FS26 family of automotive System Basis Chips. These devices are engineered to reduce board space and simplify design by integrating multiple power rails and communication interfaces. The MFS2611 variant specifically targets applications needing robust power management in compact automotive environments.
Consult NXP documentation for direct cross-references within the FS26 series. Variants such as MFS2611AMDA0AD may share similar functionality but differ in package or specific interface configurations. Always verify electrical parameters and pin compatibility before substitution.
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