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MFS2613AMDA3ADR2 is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is SAFETY SYSTEM BASIS CHIP WITH LO. Review the specifications below when checking this part for your BOM.
The MFS2613AMDA3ADR2 is an automotive Safety System Basis Chip (SBC) from the NXP FS26 series, designed for ASIL D applications. It operates within a supply voltage range of 3.2 V to 36 V and supports a maximum DC input voltage of 40 V. The device features multiple switching regulators and LDOs, delivering up to 800 mA output current with a maximum regulated output voltage of 3.35 V. It functions reliably across an extended temperature range from -40°C to +125°C. Packaged in an LQFP-48 surface-mount format, it integrates low-power modes and diagnostic capabilities for robust system management.
Verify component authenticity through authorized NXP channels due to end-of-life status. Confirm package integrity and moisture sensitivity handling prior to assembly. Cross-reference datasheet revisions to ensure compatibility with existing design specifications. Validate that the ADR2 suffix corresponds to the required reel packaging configuration for automated placement processes.
Select this variant for high-integrity automotive applications requiring ASIL D compliance. Ensure the 800 mA output capability meets load demands. Verify thermal management requirements for the LQFP-48 package. Consider OTP programming needs for permanent configuration. Evaluate wake-up source options against system power-down strategies.
Part of the FS26 family, which provides scalable solutions for automotive safety systems. The FS26 series combines power management with diagnostic functions, enabling space-efficient designs. This specific model targets critical control units where reliability and fault detection are paramount, supporting complex embedded architectures in modern vehicles.
Check for direct substitutes within the FS26 lineup such as MFS2613AMDA0AD or MFS2613AMDA4AD. Verify pinout compatibility and electrical parameter alignment before substitution. Assess if alternative packages like LQFP-48 variants offer equivalent thermal and performance characteristics.
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