MG1608-300Y

Overview

The Bourns MG1608-300Y is a high impedance chip ferrite bead in the MG series. It features a surface mount 0603 (1608 metric) package with dimensions of 1.6 mm length and 0.8 mm width. The component provides an impedance of 30 ohms at 100 MHz with a tolerance of 25%. It supports a maximum DC current rating of 200 mA and has a maximum DC resistance of 200 milliohms. The device operates within a temperature range of -55°C to +125°C.

Feature Summary

• High impedance characteristics for effective noise suppression
• Compact 0603 surface mount footprint for space-constrained designs
• Wide operating temperature range suitable for diverse environments

Applications

• Noise suppression in high-speed digital circuits
• Power line filtering in portable electronic devices
• EMI reduction in communication equipment signal lines

Procurement Notes

Verify the specific impedance value and current rating against the official Bourns datasheet before procurement, as variations may exist between distributors. Confirm the package type matches the design requirements. Ensure compliance with RoHS directives if required by the project specifications. Cross-reference the manufacturer part number to avoid counterfeit components.

Selection Notes

Select this component when a low DC resistance and moderate current handling capability are required in a small form factor. The 30-ohm impedance at 100 MHz makes it suitable for frequencies above typical power supply noise. Consider the thermal performance and physical size constraints of the PCB layout during selection.

Part Context

This ferrite bead belongs to the MG series from Bourns, designed for general-purpose noise suppression. The 0603 package allows for automated assembly and high-density mounting. It serves as a passive component to attenuate high-frequency electromagnetic interference without significantly affecting the DC signal path.

Replacement Considerations

Check for direct substitutes with identical 30-ohm impedance at 100 MHz and 200 mA current rating. Verify that alternative packages maintain the same mechanical dimensions. Ensure thermal and electrical characteristics match the original design requirements.