MG7050HAN 100.000000M-2ACJAA3

Overview

The MG7050HAN 100.000000M-2ACJAA3 is a pin-configurable HCSL SAW oscillator manufactured by EPSON. It operates at a frequency of 100MHz with a 3.3V supply voltage and draws a maximum current of 90mA. The device features a 14-SMD, no-lead package measuring 7.00mm x 5.00mm x 1.80mm. It supports dual outputs at 100MHz each and functions within an operating temperature range of 0°C to 70°C.

Feature Summary

• Pin-configurable architecture allows for flexible signal output selection.
• Utilizes SAW technology for stable low-to-mid-frequency performance.
• Supports HCSL output standards for high-speed digital interfaces.

Applications

• High-speed data transmission systems
• Clock generation for network equipment
• Server and storage subsystem timing

Procurement Notes

Verify the specific suffix code against official Epson documentation to confirm pin configuration and electrical parameters. Ensure compatibility with the target PCB footprint and thermal requirements. Confirm RoHS3 compliance status if required by project specifications. Cross-reference the manufacturer part number with authorized distributors to avoid counterfeit components.

Selection Notes

Select this component when HCSL interface compatibility and pin flexibility are required. Consider the 14-SMD package dimensions for board space constraints. Evaluate the 0°C to 70°C operating range against environmental conditions. Compare power consumption metrics with alternative oscillators if energy efficiency is critical.

Part Context

This model belongs to the MG7050HAN series of pin-configurable oscillators from EPSON. The series offers customizable output configurations to meet diverse system timing needs. These devices are designed for applications requiring reliable clock signals in compact electronic assemblies.

Replacement Considerations

Consult official substitution lists for compatible alternatives. Verify that any replacement maintains identical pin configuration and electrical characteristics. Ensure package dimensions and mounting requirements match the existing design.