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Product Detailed Parameters
- Description:IC GATE DRVR HALF-BRIDGE 32BSSOP
- Series:-
- Mfr:NXP USA Inc.
- Package:Tape & Reel (TR)
- Driven Configuration:Half-Bridge
- Channel Type:Single
- Number of Drivers:1
- Gate Type:IGBT, MOSFET (N-Channel)
- Voltage - Supply:5V
- Logic Voltage - VIL, VIH:-
- Current - Peak Output (Source, Sink):15A, 15A
- Input Type:-
- Rise / Fall Time (Typ):-
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:32-BSSOP (0.295", 7.50mm Width)
- Supplier Device Package:32-SOIC
- Grade:Automotive
- Qualification:AEC-Q100
- High Side Voltage - Max (Bootstrap):-
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Overview
The MGD3100BM58EKR2 is a single-channel, current-isolated gate driver IC designed for IGBT and SiC MOSFET applications in xEV traction inverters. It features a WSOIC-32 package with a minimum load supply voltage of -12V and maximum of 25V. The device operates within an ambient temperature range of -40°C to +125°C and supports power supply voltages from 5V to 40V. Key electrical parameters include a drain-source on-resistance (Rds On) of 500 mohms and a peak output current capability of 15A. It integrates active Miller clamp functionality and supports both PWM and SPI interfaces for control and diagnostics.
Feature Summary
- Integrates high-voltage isolation with low on-resistance drive transistors for efficient switching
- Provides active Miller clamp and secondary shutdown capabilities to minimize device stress during faults
- Supports autonomous fault management via INTB pin and SPI interface for system diagnostics
- Includes built-in self-test (BIST) and VGE monitoring to verify communication integrity
Applications
- xEV traction inverters
- IGBT gate driving systems
- SiC MOSFET gate driving systems
Procurement Notes
Verify the specific suffix EKR2 against official NXP documentation to confirm reel packaging and moisture sensitivity classification. Ensure compatibility with the FRDMGD3100HB8EVM development kit if evaluation is required. Confirm RoHS compliance status through the manufacturer's latest certification documents before integration into automotive-grade assemblies.
Selection Notes
Select this component when designing for high-reliability electric vehicle traction applications requiring current isolation. The integrated current sensing and DESAT sense options reduce bill-of-materials complexity. Ensure the design accommodates the specified 500 mohm Rds(on) and 15A output current capabilities for the target IGBT or SiC module requirements.
Part Context
This part belongs to the GD3100 series of advanced gate drivers from NXP Semiconductors. The series is engineered for high-performance power electronics, offering robust protection features and functional safety compliance. It serves as a critical interface between low-voltage controllers and high-power semiconductor switches in demanding industrial and automotive environments.
Replacement Considerations
Consult NXP official substitution lists for compatible alternatives within the GD3100 family. Verify that any substitute maintains identical isolation ratings, pinout configuration, and thermal performance specifications for direct replacement in existing designs.
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