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MIC2550ABTS-TR is listed in the Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC TRANSCEIVER HALF 1/1 14TSSOP. Review the specifications below when checking this part for your BOM.
The MIC2550ABTS-TR is a single-chip USB transceiver compliant with the USB 2.0 physical layer specifications, supporting full-speed (12Mbps) and low-speed (1.5Mbps) operation. It utilizes a patented dual supply voltage architecture, allowing system I/O signals to reference a VIF down to 2.5V while being independently powered by the USB VBUS. The device features integrated speed-select termination, very low power consumption meeting USB suspend-current requirements, and superior edge rate control for improved eye diagrams. It is housed in a 14-pin TSSOP package.
Verify the specific ordering suffix against the manufacturer's current documentation to confirm the tape and reel packaging format associated with the TR designation. Ensure the component matches the original Micrel, Inc. specifications prior to acquisition by Microchip Technology. Confirm RoHS compliance status through official datasheets before finalizing procurement orders.
Select this component when designing mobile systems where the core system supply voltage is insufficient to satisfy standard USB physical layer requirements directly. The device allows the system interface to operate at its native core voltage without requiring additional buffering logic. Verify that the application requires half-duplex communication compatible with the bidirectional VP and VM pins.
This component belongs to the MIC2550A family of Universal Serial Bus transceivers originally developed by Micrel, Inc. Following the acquisition of Micrel by Microchip Technology, these devices are now managed under the Microchip portfolio. The part number indicates the ABTS variant packaged in a 14-pin Thin Shrink Small Outline Package (TSSOP).
The MIC2550AYTS is a direct pin-compatible alternative within the same series, differing only in the MLF™ package type rather than the TSSOP form factor.
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