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MIC2583R-MYQS is listed in the Hot Swap Controllers range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC HOT SWAP CTRLR GP 16QSOP. Review the specifications below when checking this part for your BOM.
The MIC2583R-MYQS is a single-channel positive voltage hot swap controller manufactured by Microchip Technology. It is designed to facilitate the safe insertion and removal of boards into live system backplanes. The device operates within a supply voltage range of 2.3V to 13.2V and draws a supply current of 1.5 mA. It features an adjustable fault timeout, slew rate control, and under-voltage lockout (UVLO). The component is housed in a 16-lead QSOP package with a width of 3.90mm and supports an operating temperature range from -40°C to +85°C.
Verify the specific suffix MYQS corresponds to the 16-QSOP package configuration when sourcing. Confirm RoHS compliance status as per the latest manufacturer documentation. Ensure the ordering quantity aligns with standard reel packaging requirements specified by the supplier. Cross-reference the part number against official Microchip databases to validate current production status and availability.
Select this controller for applications requiring precise control over power-up sequences and protection against overcurrent events. It is suitable for systems where board insertion must occur without disrupting existing power rails. Consider the external MOSFET gate drive capability and the need for programmable fault timeouts when designing the peripheral circuitry.
This component belongs to the MIC2582/MIC2583 family of single-channel hot swap controllers. While the MIC2582 utilizes an 8-pin SOIC package, the MIC2583 variant specifically employs a 16-pin QSOP package to accommodate additional control features or pinouts required for more complex hot swap applications.
The MIC2582 serves as a functional alternative for similar hot swap applications but utilizes an 8-pin SOIC package instead of the 16-pin QSOP form factor. Verify pin compatibility and package dimensions before substituting.
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