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MIC2981/82YWM-TR
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Product Detailed Parameters
- Description：IC PWR DRIVER BIPOLAR 1:1 18SOP
- Series：-
- Mfr：Microchip Technology
- Package：Tape & Reel (TR),Cut Tape (CT)
- Switch Type：General Purpose
- Number of Outputs：8
- Ratio - Input:Output：1:01
- Output Configuration：High Side
- Output Type：Bipolar
- Interface：On/Off
- Voltage - Load：5 ~ 50V
- Voltage - Supply (Vcc/Vdd)：Not Required
- Current - Output (Max)：500mA
- Rds On (Typ)：-
- Input Type：Non-Inverting
- Features：-
- Fault Protection：-
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Supplier Device Package：18-SOP (Wide)
- Package / Case：18-SOIC (0.295", 7.50mm Width)
- Grade：-
- Qualification：-
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Overview
The MIC2981/82YWM-TR is a high-voltage, high-current source driver array manufactured by Microchip Technology. It features eight independent output channels housed in an 18-pin SOIC W package with tape and reel packaging. The device operates within a supply voltage range of 5V to 50V and delivers a maximum output current of 500mA per channel. Designed for switching high-power loads from logic-level TTL, CMOS, or PMOS control signals, it serves as a robust interface between low-power digital controllers and heavy-duty analog loads.
Feature Summary
- Provides eight independent high-current source outputs for driving multiple loads simultaneously
- Capable of switching high-power loads directly from standard logic-level control signals
- Operates reliably across a wide supply voltage range up to 50V
Applications
- Industrial motor control systems requiring multi-channel drive capabilities
- Solenoid and valve actuation arrays in automation equipment
- High-power LED lighting driver circuits
Procurement Notes
Verify the specific suffix 'TR' confirms the tape and reel packaging format required for automated surface-mount assembly processes. Ensure the order specifies the SOIC W package variant to distinguish it from PDIP alternatives. Confirm that the 500mA output rating aligns with the thermal management requirements of the target application design.
Selection Notes
Select this component when a multi-channel solution is needed to drive high-current loads from low-voltage logic interfaces. The integrated array simplifies board layout compared to discrete transistor solutions. Consider the thermal dissipation characteristics of the SOIC W package relative to the expected continuous load current and ambient operating conditions.
Part Context
This part belongs to the MIC2981/82 series of high-voltage source driver arrays. It is functionally related to other variants such as the MIC2981/82YN, which offers identical electrical performance but utilizes a PDIP package through-hole configuration. The YWM-TR designation specifically identifies the surface-mount version supplied in tape and reel for high-volume manufacturing.
Replacement Considerations
The MIC2981/82YN serves as a direct functional equivalent offering identical electrical specifications in a PDIP package. Verify pinout compatibility and thermal resistance differences when substituting between surface-mount and through-hole packages.
