MIC5841YN

Overview

The MIC5841YN is an 8-bit serial-input latched driver fabricated using BiCMOS technology. It features a single supply voltage range of 5 V to 15 V and provides eight non-inverting outputs capable of sourcing up to 500 mA each. The device operates with a clock input for data shifting and includes a latch function to maintain output states independently of the serial input. It supports unidirectional data flow triggered by the rising edge of the clock signal. The component is housed in an 18-pin DIP package and is rated for operation within a temperature range of -55°C to +85°C.

Feature Summary

• High-current output capability per channel
• Serial-to-parallel conversion with latching
• BiCMOS process for robust performance

Applications

• Driving high-current loads such as LEDs or relays
• Industrial control panel output expansion
• Automotive lighting systems

Procurement Notes

Verify the suffix 'YN' confirms the 18-pin through-hole DIP package, distinct from surface-mount variants like 'YWM'. Confirm the manufacturer designation aligns with Microchip Technology following its acquisition of Micrel. Ensure the datasheet version matches the specific revision for electrical characteristics.

Selection Notes

Select this part when high current drive is required directly from a serial interface without external transistors. Compare against standard logic drivers if lower current suffices. Consider the BiCMOS technology benefits for noise immunity and speed compared to pure CMOS alternatives in noisy environments.

Part Context

This component belongs to the MIC5841/5842 family of serial-input latched drivers originally developed by Micrel Semiconductor, now part of Microchip Technology. The series is designed to simplify the interface between microcontrollers and high-power peripheral devices by integrating shift register and latch functions with power output stages.

Replacement Considerations

The MIC5842YWM is a related variant offering similar functionality but in a surface-mount SOIC W package. Verify pin compatibility and thermal requirements when substituting between through-hole and surface-mount packages.