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MICRF102BM-TR is listed in the RF Transmitter range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is RF TX IC ASK 300-470MHZ 8SOIC. Review the specifications below when checking this part for your BOM.
The MICRF102BM-TR is a single-chip RF transmitter IC designed for remote wireless applications, utilizing QwikRadio technology. It operates within the 300MHz to 470MHz frequency range and supports ASK and OOK modulation protocols. The device delivers an output power of -4dBm with a maximum data rate of 20kbps. It functions on a supply voltage ranging from 4.75V to 5.5V and draws a transmission current of 4.7mA. Packaged in an 8-SOIC surface-mount case, it is rated for industrial temperatures between -40°C and 85°C.
Verify component status carefully as the MICRF102 series has been discontinued by major distributors like DigiKey. Confirm availability through authorized channels or alternative suppliers. Ensure the specific suffix matches required packaging standards. Cross-reference datasheets for any revisions that may affect pin compatibility or electrical characteristics before finalizing procurement decisions.
Select this component for applications requiring simple, low-cost RF transmission in the sub-GHz band. It is suitable for designs prioritizing minimal external components due to integrated antenna matching. Consider the limited data rate and output power when evaluating link budget requirements. Verify that the operating environment falls within the specified temperature range for long-term reliability.
This part belongs to the MICRF102 family of RF transmitters originally developed by Micrel Semiconductor, which was later acquired by Microchip Technology. The series is characterized by its ease of use and low component count for basic remote control tasks. The MICRF102BM-TR specifically denotes the tape-and-reel packaging variant of the standard SOIC package version.
The MICRF102YM is listed as a direct substitute for the MICRF102BM series. Verify functional equivalence and package compatibility before implementation.
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