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MICRF112YMU-TR is listed in the RF Transmitter range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is RF TX IC ASK 300-450MHZ 10XFDFN. Review the specifications below when checking this part for your BOM.
The MICRF112YMU-TR is an RF transmitter IC from Microchip Technology's QwikRadio series, designed for ASK and FSK modulation. It operates within a frequency range of 300 MHz to 450 MHz, supporting a maximum data rate of 50 kbps. The device delivers an output power of 10 dBm with a transmission current of 11 mA. It functions on a supply voltage ranging from 1.8 V to 3.6 V, typically at 2.5 V or 3.3 V. Housed in a compact 10-pin UTDFN (2x2 mm) package with exposed pad, it supports surface mount mounting and operates across a temperature range of -40°C to +125°C.
Verify the specific suffix 'YMU' indicates the 10-pin UTDFN package variant distinct from other package options like MSOP. Confirm RoHS compliance status as per the latest manufacturer documentation. Ensure the ordering part number matches the required tape and reel quantity specifications for automated assembly processes.
Select this component when a small form factor is critical alongside moderate output power requirements. The UTDFN package offers a smaller footprint compared to MSOP alternatives while maintaining similar electrical performance. Consider the 300-450 MHz frequency band compatibility with regional regulatory standards before finalizing the design integration.
This part belongs to the MICRF112 family of simple, low-cost RF transmitters. It is manufactured by Microchip Technology, formerly Micrel. The YMU suffix specifically denotes the 10-UTDFN (2x2 mm) package type with an exposed thermal pad, differentiating it from the MSOP variant found in other part numbers within the same functional series.
The MICRF112YMM-TR serves as a direct package alternative offering identical electrical characteristics but housed in a 10-TFSOP/MSOP format. Designers must evaluate PCB layout changes due to the difference in physical dimensions and thermal pad requirements between the UTDFN and MSOP packages.
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