— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:I.MX 8DUALXPLUS 17X17
- Series:i.MX8Q
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:ARM® Cortex®-A53, ARM® Cortex®-M4F
- Number of Cores/Bus Width:3 Core, 64-Bit
- Speed:1.2GHz, 264MHz
- Co-Processors/DSP:Multimedia; NEON, Hi-Fi4 DSP
- RAM Controllers:DDR3L SDRAM, LPDDR4 DRAM
- Graphics Acceleration:Yes
- Display & Interface Controllers:LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:-
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:417-BFBGA
- Supplier Device Package:417-FBGA (17x17)
- Additional Interfaces:-
- Grade:-
- Qualification:-
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Overview
The MIMX8DX1FVOFZAC is an i.MX 8DualXPlus automotive and infotainment processor from NXP Semiconductors. It features a multicore architecture with two Cortex-A35 cores running at 1.2 GHz and one Cortex-M4F core operating at 264 MHz. The device includes a Tensilica HiFi 4 DSP for audio processing. Memory interfaces support 16-bit LPDDR4 and 16-bit DDR3L without ECC. Connectivity options include USB 3.0, dual Gigabit Ethernet with AVB, three CAN/CAN-FD controllers, PCIe 3.0, and multiple display outputs such as MIPI-DSI and LVDS.
Feature Summary
- Multicore architecture combining high-performance Cortex-A35 application cores with a real-time Cortex-M4F core
- Integrated Tensilica HiFi 4 DSP for advanced audio pre- and post-processing
- Advanced security features including High Assurance Boot (AHAB) and hardware cryptographic acceleration
- Flexible display controller supporting up to three independent displays with SafeAssure failover protection
Applications
- Automotive instrument clusters and digital cockpits
- Vehicle-to-everything (V2X) communication systems
- Infotainment and telematics control units
- Industrial control systems requiring safety-critical processing
Procurement Notes
Verify the specific ordering suffix against the official NXP datasheet to confirm package dimensions and feature availability. Ensure compatibility with the required System Controller Firmware (SCFW) version for correct operation. Confirm that the selected memory configuration aligns with the 17x17 mm package restrictions regarding DDR interface width and density.
Selection Notes
Select this component when a balance of processing power and connectivity is required for automotive applications. The 17x17 mm FCPBGA package offers a smaller footprint compared to the 21x21 mm variant but restricts certain interfaces like USB 3.0 SuperSpeed and reduces available SD card slots. Evaluate thermal requirements and ensure the design supports the necessary power management IC for stable operation.
Part Context
This processor belongs to the i.MX 8X family, which also includes the i.MX 8QuadXPlus. Both families share similar architectural foundations but differ in core counts and I/O availability based on the package size. The i.MX 8DualXPlus provides a cost-effective solution for applications that do not require the full quad-core performance or extensive peripheral count of the QuadXPlus variant.
Replacement Considerations
MIMX8DX1AVLFZAC: Offers identical specifications but lacks FIPS 140-2 certification for the DSP. MIMX8DX1FVLFZAC: Uses the larger 21x21 mm package, providing additional I/O capabilities such as USB 3.0 SuperSpeed and expanded display interfaces.
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