MIMX8DX2FVLFZAC

MIMX8DX2FVLFZAC

$66.12
  • Description:I.MX 8DUALXPLUS 21X21
  • Series:i.MX8Q
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:c0ece29960f3 Category: Brand:

  
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Product Detailed Parameters

  • Description:I.MX 8DUALXPLUS 21X21
  • Series:i.MX8Q
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Core Processor:ARM® Cortex®-A53, ARM® Cortex®-M4F
  • Number of Cores/Bus Width:3 Core, 64-Bit
  • Speed:1.2GHz, 264MHz
  • Co-Processors/DSP:Multimedia; NEON, Hi-Fi4 DSP
  • RAM Controllers:DDR3L SDRAM, LPDDR4 DRAM
  • Graphics Acceleration:Yes
  • Display & Interface Controllers:LCD, LVDS, MIPI-CSI, MIPI-DSI
  • Ethernet:10/100/1000Mbps (2)
  • SATA:-
  • USB:USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
  • Voltage - I/O:1.8V, 2.5V, 3.3V
  • Operating Temperature:-
  • Security Features:3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
  • Mounting Type:Surface Mount
  • Package / Case:609-BFBGA
  • Supplier Device Package:609-FBGA (21x21)
  • Additional Interfaces:CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
  • Grade:-
  • Qualification:-

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MIMX8DX2FVLFZAC

Overview

The MIMX8DX2FVLFZAC is an i.MX 8DualXPlus automotive and infotainment application processor from NXP Semiconductors. It features a multicore architecture with two Arm Cortex-A35 cores operating at up to 1.2 GHz and one Arm Cortex-M4F core running at 264 MHz. The device includes a Tensilica HiFi 4 DSP for audio processing and supports FIPS 140-2 certification. It utilizes a 21 x 21 mm FCPBGA package with a 0.8 mm pitch.

Feature Summary

  • Multicore processing with dual Cortex-A35 and single Cortex-M4F cores
  • Integrated Tensilica HiFi 4 DSP for high-performance audio tasks
  • Supports FIPS 140-2 certified security operations
  • Includes GPU, VPU, and failover-ready display controller

Applications

  • Automotive infotainment systems
  • Vehicle telematics and connectivity
  • Industrial control applications

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official data sheet to confirm feature availability, such as GPU support and memory interface width. Ensure compatibility with required System Controller Firmware (SCFW) versions for stable operation. Confirm package dimensions and pinout requirements match the target PCB design specifications.

Selection Notes

Select this component for designs requiring certified security features alongside multimedia capabilities. The 21x21mm package offers full peripheral access compared to smaller variants. Consider thermal management solutions suitable for automotive temperature ranges when integrating this processor into the final system architecture.

Part Context

This part belongs to the i.MX 8X family, specifically the DualXPlus series designed for automotive and infotainment markets. It shares architectural similarities with the QuadXPlus but offers a reduced core count. The device is part of NXP's EdgeVerse platform, supporting long-term supply programs for industrial and automotive deployments.

Replacement Considerations

MIMX8DX2AVLFZAC: Identical hardware configuration but without FIPS 140-2 certification.

MIMX8DX2FVLFZACMIMX8DX2FVLFZAC
$66.12
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