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Product Detailed Parameters
- Description:I.MX 8DUALXPLUS 17X17
- Series:i.MX8Q
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:ARM® Cortex®-A53, ARM® Cortex®-M4F
- Number of Cores/Bus Width:3 Core, 64-Bit
- Speed:1.2GHz, 264MHz
- Co-Processors/DSP:Multimedia; NEON, Hi-Fi4 DSP
- RAM Controllers:DDR3L SDRAM, LPDDR4 DRAM
- Graphics Acceleration:Yes
- Display & Interface Controllers:LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:-
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:417-BFBGA
- Supplier Device Package:417-FBGA (17x17)
- Additional Interfaces:-
- Grade:-
- Qualification:-
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Overview
The MIMX8DX2FVOFZAC is an i.MX 8DualXPlus processor featuring two ARM Cortex-A35 cores at 1.2 GHz and one Cortex-M4F core at 264 MHz. It utilizes a 17x17 mm FCPBGA package with a 0.8 mm pitch. The device supports 16-bit LPDDR4 memory interfaces and includes a Tensilica HiFi 4 DSP. Connectivity options encompass USB 3.0, dual Gigabit Ethernet with AVB, three CAN/CAN-FD controllers, PCIe 3.0, and MIPI-CSI camera input.
Feature Summary
- Integrated failover-ready display controller with SafeAssure technology for software failure recovery
- Advanced security features including High Assurance Boot (AHAB) and hardware-based tamper detection
- High-performance multimedia processing via dedicated GPU and VPU subsystems
- Support for multiple independent displays through MIPI-DSI and LVDS interfaces
Applications
- Automotive infotainment systems
- Vehicle-to-everything (V2X) communication modules
- Industrial control applications requiring real-time processing
Procurement Notes
Verify the specific ordering suffix to confirm feature availability, as the 'F' designation indicates FIPS 140-2 certification while 'O' denotes the smaller package variant. Confirm System Controller Firmware (SCFW) compatibility with your chosen Board Support Package release to ensure correct operation and prevent reliability issues. Cross-reference the datasheet's ordering tables to validate pinout and interface restrictions associated with the 17x17 mm package.
Selection Notes
Select this component when automotive-grade reliability and secure boot are required alongside moderate multimedia capabilities. The 17x17 mm package offers reduced I/O compared to the 21x21 mm variant, specifically limiting DDR width to 16-bit and removing USB 3.0 SuperSpeed support. Ensure the application design accommodates the specific IOMUX restrictions and missing peripheral balls inherent to this smaller form factor.
Part Context
This processor belongs to the i.MX 8X family, which also includes the i.MX 8QuadXPlus. While sharing the same core architecture and software ecosystem, the DualXPlus variant provides fewer application cores and reduced peripheral connectivity compared to the QuadXPlus. It is designed specifically for cost-sensitive automotive and industrial applications that do not require the full multimedia throughput of the higher-end models.
Replacement Considerations
MIMX8DX2AVOFZAC
FAQ
Does the MIMX8DX2FVOFZAC support USB 3.0 SuperSpeed?
No, the 17x17 mm package variant does not include USB 3.0 SuperSpeed support; it only provides USB 2.0 OTG functionality.
What is the maximum supported DRAM density for this package?
Due to the reduced 16-bit DDR interface on the 17x17 mm package, the maximum supported DRAM density is lower than that of the 21x21 mm package variants.
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