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Product Detailed Parameters
- Description:I.MX 8DUALXPLUS 21X21
- Series:-
- Mfr:NXP USA Inc.
- Package:Tray
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- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:609-BFBGA
- Supplier Device Package:609-FBGA (21x21)
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- Grade:-
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Overview
The MIMX8DX5AVLFZAC is an i.MX 8DualXPlus application processor featuring a multicore architecture with two Arm Cortex-A53 cores and one Arm Cortex-M4F core. It operates at clock speeds up to 1.2 GHz for the A53 cores and 264 MHz for the M4F core. The device utilizes a 609-ball FCBGA package measuring 21x21 mm. It supports DDR3L SDRAM and LPDDR4 DRAM memory interfaces. The processor includes integrated graphics acceleration, multimedia capabilities with NEON and Hi-Fi4 DSP, and extensive connectivity options including dual Gigabit Ethernet, USB 2.0 OTG, USB 3.0 OTG, PCIe, and multiple serial interfaces.
Feature Summary
- Multicore processing combining high-performance Cortex-A53 cores with a real-time Cortex-M4F core
- Integrated hardware security features including CAAM, HAB, and ARM TrustZone
- Advanced multimedia support with GPU acceleration and Hi-Fi4 DSP
- Comprehensive connectivity suite including dual Gigabit Ethernet and USB 3.0
Applications
- Industrial control systems
- Automotive infotainment and telematics
- V2X communication modules
- Smart building automation
Procurement Notes
Verify component authenticity through authorized NXP distributors or certified suppliers. Confirm the specific suffix 'AC' matches design requirements as it denotes package and temperature grade. Check current lifecycle status as availability may vary. Ensure ESD protection protocols are followed during handling due to the fine-pitch BGA packaging. Validate supply chain documentation against official NXP part number databases prior to integration.
Selection Notes
Select this processor when a balance of application processing power and real-time control is required within a compact form factor. The i.MX 8DualXPlus series is suitable for designs needing robust security features alongside multimedia performance. Consider the 609-ball package size for PCB layout constraints. Evaluate memory interface compatibility with DDR3L or LPDDR4 options based on system bandwidth needs and power consumption targets.
Part Context
This component belongs to the NXP i.MX 8X family of applications processors, designed for edge computing and IoT applications. The i.MX 8DualXPlus variant specifically targets automotive and industrial markets requiring functional safety and high reliability. It sits within the broader i.MX portfolio that spans from low-power microcontrollers to high-performance quad-core processors, offering scalable solutions for diverse embedded computing tasks.
Replacement Considerations
Check for direct pin-to-pin compatible alternatives within the i.MX 8QX or i.MX 8DX families if higher core counts are needed. Verify software compatibility with existing BSPs when considering upgrades to newer silicon revisions. Consult NXP documentation for any known errata or recommended design changes associated with successor models.
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