MIMX8QX5GVLFZAC

MIMX8QX5GVLFZAC

$67.22
  • Description:I.MX 8X FIPS
  • Series:i.MX8Q
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:adb3f2032b3e Category: Brand:

  
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Product Detailed Parameters

  • Description:I.MX 8X FIPS
  • Series:i.MX8Q
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Core Processor:ARM® Cortex®-A53, ARM® Cortex®-M4F
  • Number of Cores/Bus Width:3 Core, 64-Bit
  • Speed:1.2GHz, 264MHz
  • Co-Processors/DSP:Multimedia; NEON, Hi-Fi4 DSP
  • RAM Controllers:DDR3L SDRAM, LPDDR4 DRAM
  • Graphics Acceleration:Yes
  • Display & Interface Controllers:LCD, LVDS, MIPI-CSI, MIPI-DSI
  • Ethernet:10/100/1000Mbps (2)
  • SATA:-
  • USB:USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
  • Voltage - I/O:1.8V, 2.5V, 3.3V
  • Operating Temperature:-40°C ~ 125°C (TJ)
  • Security Features:3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
  • Mounting Type:Surface Mount
  • Package / Case:609-BFBGA
  • Supplier Device Package:609-FBGA (21x21)
  • Additional Interfaces:CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
  • Grade:-
  • Qualification:-

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MIMX8QX5GVLFZAC

Overview

The MIMX8QX5GVLFZAC is an i.MX 8QuadXPlus microprocessor from NXP Semiconductors, designed for automotive applications. It features a composite core architecture including four Arm Cortex-A35 cores and one Arm Cortex-M4F core. The device operates within the i.MX 8x series and utilizes a 609-BFBGA package with dimensions of 21x21 mm. It supports high-reliability boot processes and includes hardware security modules such as AES-128/256 encryption and RSA key storage.

Feature Summary

  • Automotive-grade reliability compliant with AEC-Q100 standards
  • Integrated hardware security engine for secure boot and data protection
  • Multi-core processing combining application and real-time control functions

Applications

  • Advanced Driver Assistance Systems (ADAS)
  • Digital cockpit infotainment systems
  • Telematics control units

Procurement Notes

Verify the specific suffix 'G' against official NXP documentation to confirm temperature range and feature set variations. Ensure compatibility with required power management ICs and memory configurations. Confirm RoHS compliance status and lead times through authorized distributors. Validate package pinout alignment with PCB design requirements before procurement.

Selection Notes

Select this component when automotive safety integrity and secure connectivity are required. The combination of Cortex-A35 and Cortex-M4F allows separation of complex OS tasks from real-time control loops. Consider thermal dissipation capabilities in fanless or low-airflow vehicle environments. Verify software support for target operating systems such as Linux or QNX.

Part Context

This part belongs to the i.MX 8QuadXPlus family, targeting high-performance automotive clusters. It sits between the i.MX 8QuadMax and i.MX 8QuadPlus in terms of integration, offering balanced performance for display-rich interfaces. The 609-ball FBGA package facilitates compact board designs suitable for modern vehicle architectures.

Replacement Considerations

MIMX8QX5AVLFZAC: Check if lower frequency variants meet system requirements. MIMX8QX6GVLFZAC: Verify if additional cache or memory controllers are needed.

MIMX8QX5GVLFZACMIMX8QX5GVLFZAC
$67.22
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