— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:I.MX 8X FIPS
- Series:i.MX8Q
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:ARM® Cortex®-A53, ARM® Cortex®-M4F
- Number of Cores/Bus Width:3 Core, 64-Bit
- Speed:1.2GHz, 264MHz
- Co-Processors/DSP:Multimedia; NEON, Hi-Fi4 DSP
- RAM Controllers:DDR3L SDRAM, LPDDR4 DRAM
- Graphics Acceleration:Yes
- Display & Interface Controllers:LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:-40°C ~ 125°C (TJ)
- Security Features:3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
- Mounting Type:Surface Mount
- Package / Case:609-BFBGA
- Supplier Device Package:609-FBGA (21x21)
- Additional Interfaces:CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
- Grade:-
- Qualification:-
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Overview
The MIMX8QX6GVLFZAC is an embedded microprocessor IC from NXP Semiconductors, part of the i.MX 8QuadXPlus family. It features a dual-core ARM Cortex-A53 processor running at 1.2 GHz and a single-core ARM Cortex-M4F processor operating at 264 MHz. The device is housed in a 609-ball Fine-pitch Ball Grid Array (FBGA) package with dimensions of 21 mm x 21 mm. It supports automotive-grade applications with integrated security features including FIPS compliance.
Feature Summary
- Integrates high-performance ARM Cortex-A53 cores for complex application processing alongside an energy-efficient Cortex-M4F core for real-time control tasks.
- Includes dedicated hardware security modules supporting FIPS standards to ensure data integrity and secure boot capabilities.
- Provides multiple display interfaces including MIPI-DSI and LVDS for versatile visual output configurations.
Applications
- Automotive instrument clusters and digital cockpit displays
- Infotainment systems requiring secure media playback
- Industrial human-machine interface (HMI) panels
Procurement Notes
Verify the specific suffix GVLFZAC against official NXP documentation to confirm the exact speed grade and temperature range. Ensure compatibility with existing board designs regarding the 609-FBGA footprint and pinout. Check for any required external memory components specified in the datasheet for proper system initialization.
Selection Notes
Select this component when a balance of computational power and real-time control is required within automotive or industrial constraints. The inclusion of the Cortex-M4F allows for offloading time-critical tasks from the main application processors. Consider the thermal dissipation requirements associated with the 21x21 mm package size during PCB layout.
Part Context
This microprocessor belongs to the i.MX 8QuadXPlus series, designed specifically for demanding automotive and industrial environments. It offers a scalable architecture that supports various connectivity options and display controllers, making it suitable for next-generation smart devices requiring robust performance and security.
Replacement Considerations
Check NXP's official cross-reference tools for compatible alternatives within the i.MX 8 family. Ensure any substitute maintains the same FBGA609 package and pinout compatibility to avoid redesigning the carrier board.
FAQ
What is the maximum operating temperature for the MIMX8QX6GVLFZAC?
As an automotive-grade component, it is designed to operate within extended industrial temperature ranges as defined by its specific qualification level.
Does this processor support secure boot?
Yes, the device includes hardware security features that support secure boot processes to prevent unauthorized code execution.
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