MIMX8UD3CVP08SC

$19.58

Description：8ULP DUAL CORTEX A35
Series：-
Mfr：NXP USA Inc.
Package：Tray

SKU:30e18dd9eed4 Category: Microprocessors Brand: NXP USA Inc.

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Product introduction

Product Detailed Parameters

Description：8ULP DUAL CORTEX A35
Series：-
Mfr：NXP USA Inc.
Package：Tray
Core Processor：-
Number of Cores/Bus Width：-
Speed：-
Co-Processors/DSP：-
RAM Controllers：-
Graphics Acceleration：-
Display & Interface Controllers：-
Ethernet：-
SATA：-
USB：-
Voltage - I/O：-
Operating Temperature：-
Security Features：-
Mounting Type：Surface Mount
Package / Case：485-LFBGA
Supplier Device Package：485-LFBGA (15x15)
Additional Interfaces：-
Grade：-
Qualification：-

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MIMX8UD3CVP08SC

Overview

The MIMX8UD3CVP08SC is an RF System on a Chip (SoC) from the NXP i.MX 8ULP family. It features dual Arm Cortex-A35 cores operating at 800 MHz and an Arm Cortex-M33 core running at 216 MHz. The device integrates a Cadence Tensilica HiFi4 DSP for advanced audio and machine learning, alongside a Fusion DSP for low-power voice processing. It includes a 3D/2D GPU, EdgeLock secure enclave, and supports LPDDR3/LPDDR4/LPDDR4x memory. The component is housed in a 15 mm x 15 mm MAPBGA package with a 0.5 mm pitch and operates within a temperature range of -40°C to +105°C.

Feature Summary

Heterogeneous multi-core architecture combining application and real-time domains
Integrated hardware security via EdgeLock secure enclave
Specialized digital signal processors for audio and AI acceleration
Comprehensive peripheral connectivity including Ethernet and USB

Applications

Smart home control systems
Wearable electronic devices
IoT edge solutions

Procurement Notes

Verify the specific silicon revision and fusing options against the project requirements before procurement. Confirm that the MAPBGA package dimensions align with the PCB footprint design. Ensure the supply chain source provides valid documentation regarding RoHS compliance and long-term availability commitments.

Selection Notes

Select this part when ultra-low power consumption is critical for battery-operated applications. The combination of high-performance A35 cores and efficient M33/DSP units allows for complex OS execution alongside real-time sensor handling. Consider the industrial temperature rating for environments requiring robust thermal performance.

Part Context

This component belongs to the i.MX 8ULP series, designed for energy-efficient edge computing. It utilizes NXP's Energy Flex architecture to integrate heterogeneous domains. The processor supports multiple power modes to optimize efficiency across various operational states, making it suitable for always-on smart devices.