MIMX8UD3DVP08SC

$23.89

Description：I.MX8ULP, DUAL 800MHZ
Series：-
Mfr：NXP USA Inc.
Package：Tray

SKU:4db45d7ba2cc Category: Microprocessors Brand: NXP USA Inc.

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Product introduction

Product Detailed Parameters

Description：I.MX8ULP, DUAL 800MHZ
Series：-
Mfr：NXP USA Inc.
Package：Tray
Core Processor：-
Number of Cores/Bus Width：-
Speed：-
Co-Processors/DSP：-
RAM Controllers：-
Graphics Acceleration：-
Display & Interface Controllers：-
Ethernet：-
SATA：-
USB：-
Voltage - I/O：-
Operating Temperature：-
Security Features：-
Mounting Type：Surface Mount
Package / Case：485-LFBGA
Supplier Device Package：485-LFBGA (15x15)
Additional Interfaces：-
Grade：-
Qualification：-

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MIMX8UD3DVP08SC

Overview

The MIMX8UD3DVP08SC is an RF System on a Chip from the i.MX 8ULP family, manufactured by NXP Semiconductors. It features dual Arm Cortex-A35 cores operating at 800 MHz and an Arm Cortex-M33 core running at 216 MHz. The device integrates a Cadence Tensilica HiFi4 DSP for advanced audio and machine learning, alongside a Fusion DSP for low-power tasks. It supports LPDDR3/LPDDR4/LPDDR4X memory interfaces and includes EdgeLock secure enclave technology. The component operates within a temperature range of -40°C to +85°C and utilizes a MAPBGA package.

Feature Summary

Heterogeneous multi-core architecture combining high-performance application processing with real-time control capabilities
Integrated hardware acceleration for digital signal processing and cryptographic functions via dedicated co-processors
Comprehensive multimedia support including 3D/2D graphics processing and MIPI display/camera interfaces
Advanced security framework featuring a secure enclave with root of trust and hardware-based encryption

Applications

Wearable devices requiring ultra-low power consumption
Smart home sensors and battery-operated personal devices
Edge AI and machine learning inference applications
Low-power audio and voice processing systems

Procurement Notes

Verify the specific silicon revision and package type against the official NXP datasheet before integration. Confirm that the industrial temperature rating aligns with your environmental requirements. Ensure compatibility with the required LPDDR memory configuration and check for any relevant errata documents associated with this part number prior to final design approval.

Selection Notes

Select this component when designing energy-efficient edge devices that require both complex OS execution and deterministic real-time control. It is suitable for applications needing integrated wireless connectivity peripherals and specialized DSP capabilities for audio or ML tasks without external processors. Consider the MAPBGA package constraints during PCB layout planning.

Part Context

This part belongs to the i.MX 8ULP series, which is designed specifically for ultra-low-power applications. The series differentiates itself by integrating a RISC-V based power management subsystem alongside the ARM cores. It targets the growing market for intelligent, battery-powered IoT endpoints that require local processing capabilities rather than relying solely on cloud connectivity.