MIMX8UD5DVP08SC

Overview

The MIMX8UD5DVP08SC is an RF System on a Chip (SoC) belonging to the NXP i.MX 8ULP series. It integrates Arm Cortex-A35 and Cortex-M33 cores for ultra-low-power, energy-efficient applications. The device operates at a frequency of 800 MHz and supports a wide operating temperature range from -40°C to +85°C. Designed for surface mount technology (SMD/SMT), it utilizes silicon technology within the Wireless & RF Integrated Circuits category.

Feature Summary

• Integrates Arm Cortex-A35 and Cortex-M33 cores for heterogeneous processing
• Optimized for ultra-low-power and energy-efficient operation
• Supports rich 3D/2D graphics capabilities

Applications

• Ultra-low-power edge computing devices
• Energy-efficient wireless sensor nodes
• Battery-operated IoT endpoints requiring graphical interfaces

Procurement Notes

Verify the specific suffix DVP08SC against official NXP documentation to confirm package type and pinout compatibility. Ensure the selected variant meets the required industrial temperature specifications (-40°C to +85°C). Cross-reference the datasheet for any errata or known hardware revisions that may impact system integration. Confirm availability status with authorized distributors as supply constraints may apply.

Selection Notes

Select this component when a balance of application processing and real-time control is needed in a power-constrained environment. The dual-core architecture allows separation of high-level OS tasks on the Cortex-A35 and deterministic control on the Cortex-M33. Consider the integrated graphics support if visual feedback is required without external display controllers.

Part Context

This part is part of the i.MX 8ULP family, designed specifically for low-power applications. Unlike higher-performance i.MX 8M or i.MX 8X series, the 8ULP focuses on minimal energy consumption while maintaining sufficient compute power for basic connectivity and sensing tasks. It represents NXP's strategy for extending battery life in distributed edge devices.

Replacement Considerations

Check for variants with different suffixes indicating package changes or temperature ranges within the same core specification. Verify if older revisions require updated bootloaders or firmware configurations.