MIMX8UD7DVP08SC

Overview

The MIMX8UD7DVP08SC is an RF System on a Chip from the NXP i.MX 8ULP family. It features dual Arm Cortex-A35 cores operating at 800 MHz and an Arm Cortex-M33 core running at 216 MHz. The device integrates a Cadence Tensilica HiFi4 DSP for advanced audio and machine learning, alongside a Fusion DSP for low-power voice processing. It includes a 3D/2D GPU, EdgeLock secure enclave, and interfaces for LPDDR3/LPDDR4/LPDDR4x memory. The component is housed in a 9.4 mm x 9.4 mm FCBGA package with a 0.4 mm pitch, designed for commercial temperature ranges.

Feature Summary

• Heterogeneous multi-core architecture combining high-performance application processing with real-time control capabilities
• Integrated hardware security via EdgeLock secure enclave providing root of trust and cryptographic acceleration
• Specialized digital signal processors optimized for ultra-low power audio, voice recognition, and edge AI inference
• Advanced multimedia subsystem featuring 3D graphics acceleration and dedicated display controllers

Applications

• Smart home control systems requiring low standby power
• Wearable devices with strict energy constraints
• IoT edge solutions utilizing local machine learning processing

Procurement Notes

Verify the specific suffix DVP against the official NXP i.MX 8ULP data sheet to confirm the FCBGA package type and commercial temperature range specifications. Ensure compatibility with required external memory types such as LPDDR3 or LPDDR4. Cross-reference the silicon revision A2 errata document for any known hardware limitations relevant to your design implementation.

Selection Notes

Select this part when designing applications that require simultaneous execution of rich operating systems and real-time control tasks within a minimal power envelope. The inclusion of dedicated DSPs makes it suitable for always-on voice wake-word detection. Consider the available GPIO count and interface options against peripheral requirements before finalizing the selection.

Part Context

This component belongs to the i.MX 8ULP series, which utilizes NXP’s Energy Flex architecture. This design combines heterogeneous computing domains with specialized power management subsystems to deliver superior efficiency across various operational states. The series targets the growing market for intelligent edge devices that demand both computational power and extended battery life.

Replacement Considerations

MIMX8UD7CVP08SC offers industrial temperature range (-40°C to +105°C) with identical core specifications but uses a MAPBGA package.