MIMX8US3CVP08SC

Overview

The MIMX8US3CVP08SC is an i.MX 8ULP RF System on a Chip featuring dual Arm Cortex-A35 cores at 800 MHz and an Arm Cortex-M33 core at 216 MHz. It includes a Cadence Tensilica Fusion DSP, EdgeLock secure enclave, and supports LPDDR3/4/4X memory. The device utilizes a 485-ball MAPBGA package (15x15 mm) with a temperature range of -40°C to +105°C.

Feature Summary

• Heterogeneous multicore architecture combining application processing with real-time control
• Integrated EdgeLock secure enclave for hardware-based security and root of trust
• Dedicated low-power audio and sensor hub processing via Fusion DSP
• Advanced power management subsystem supporting multiple ultra-low power modes

Applications

• Smart home control systems
• Wearable devices
• IoT edge solutions

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to confirm package type, temperature grade, and silicon revision. Ensure compatibility with required external memory interfaces and peripheral configurations before finalizing procurement decisions.

Selection Notes

Select this component for applications requiring simultaneous execution of rich operating systems and real-time tasks. Consider the integrated graphics capabilities and extensive connectivity options when designing human-machine interfaces or complex peripheral networks.

Part Context

This part belongs to the NXP i.MX 8ULP family, designed for energy-efficient edge computing. It integrates high-performance CPU cores with specialized accelerators for audio, machine learning, and cryptographic functions within a compact industrial-grade package.

Replacement Considerations

MIMX8UD3CVP08SC