MIMX8US3DVK08SC

Overview

The MIMX8US3DVK08SC is an RF System on a Chip from the i.MX 8ULP family by NXP Semiconductors. It integrates dual Arm Cortex-A35 cores running at 800 MHz and an Arm Cortex-M33 core operating at 216 MHz. The device features a Cadence Tensilica HiFi4 DSP for advanced audio and ML, alongside a Fusion DSP for low-power tasks. It includes a 3D GPU supporting OpenGL ES 3.1 and Vulkan, plus a 2D GPU. Memory interfaces support LPDDR3/LPDDR4/LPDDR4X up to 2 GB, Octal SPI NOR flash, and eMMC. Connectivity includes 10/100 Ethernet, FlexCAN, USB 2.0 OTG, MIPI DSI, and MIPI CSI. It utilizes a 9.4x9.4 mm FCBGA package with a 0.4 mm pitch, rated for commercial temperatures from 0°C to +95°C.

Feature Summary

• Heterogeneous multi-core architecture combining high-performance application processing with real-time control and specialized DSP acceleration.
• Integrated EdgeLock secure enclave providing hardware-based root of trust, secure boot, and cryptographic acceleration for data protection.
• Advanced multimedia capabilities including 3D/2D graphics processing and dedicated engines for low-power audio, voice recognition, and edge AI/ML inference.

Applications

• Smart home devices requiring ultra-low power consumption and local AI processing
• Industrial IoT sensors and gateways needing robust connectivity and security
• Wearable electronics and health monitoring devices demanding small form factors

Procurement Notes

Verify the specific silicon revision and temperature grade against project requirements before ordering. Confirm that the FCBGA package dimensions and pinout match the PCB layout constraints. Ensure compatibility with the required external memory types (LPDDR3/4/4X) and storage interfaces. Check for any latest errata documents related to the A2 silicon revision for known hardware limitations or workarounds.

Selection Notes

Select this part when a balance of rich OS capability and extreme power efficiency is critical. The inclusion of both Cortex-A35 and Cortex-M33 allows separation of complex applications from real-time control loops. Consider the integrated GPU and DSP if visual or audio processing is needed without external accelerators. Verify that the commercial temperature range meets the operational environment specifications.

Part Context

This component belongs to the i.MX 8ULP series, designed specifically for energy-efficient edge computing. It differs from higher-performance i.MX 8M or i.MX 8 families by prioritizing ultra-low power states and smaller package sizes over raw computational throughput. It serves as a bridge between simple microcontrollers and more powerful application processors in battery-powered scenarios.

Replacement Considerations

Check for MIMX8UD3DVK08SC for industrial temperature range (-40°C to +105°C). Verify if the MAPBGA package variant is preferred for manufacturing reasons. Consult NXP documentation for any newer silicon revisions or updated part numbers within the i.MX 8ULP portfolio.

FAQ

What is the maximum supported external memory capacity?

The LPDDR controller supports up to 2 GB of DDR memory space via LPDDR3, LPDDR4, or LPDDR4x interfaces.

Does this SoC include hardware security features?

Yes, it includes the EdgeLock secure enclave with a dedicated core, secure boot (AHAB), cryptographic acceleration, and one-time programmable fuses for key storage.