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Product Detailed Parameters
- Description:I.MX8ULP,DUAL 800MHZ
- Series:i.MX8ULP
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:ARM® Cortex®-A35
- Number of Cores/Bus Width:1 Core, 64-Bit
- Speed:800MHz
- Co-Processors/DSP:ARM® Cortex®-M33
- RAM Controllers:LPDDR3, LPDDR4
- Graphics Acceleration:No
- Display & Interface Controllers:MIPI-CSI, MIPI-DSI
- Ethernet:10/100Mbps
- SATA:-
- USB:USB 2.0 (2)
- Voltage - I/O:-
- Operating Temperature:0°C ~ 95°C (TJ)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:485-LFBGA
- Supplier Device Package:485-LFBGA (15x15)
- Additional Interfaces:I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
- Grade:-
- Qualification:-
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Overview
The NXP MIMX8US3DVP08SC is an RF System on a Chip (SoC) belonging to the i.MX 8ULP family. It integrates dual Arm Cortex-A35 cores operating at 800 MHz and a single Arm Cortex-M33 core running at 216 MHz. The device features a Cadence Tensilica HiFi4 DSP for advanced audio and machine learning, alongside a Fusion DSP for low-power voice processing. It includes a 3D/2D GPU, EdgeLock secure enclave, and supports LPDDR3/LPDDR4/LPDDR4x memory interfaces. The component is housed in a 15 mm x 15 mm MAPBGA package with a 0.5 mm pitch, designed for industrial temperature ranges.
Feature Summary
- Heterogeneous multi-core architecture combining application and real-time domains
- Integrated hardware security via EdgeLock secure enclave and cryptographic accelerators
- Specialized digital signal processors for low-power audio and edge AI/ML tasks
- Comprehensive peripheral set including Ethernet, USB, and MIPI display/camera interfaces
Applications
- Smart home control systems
- Wearable electronic devices
- IoT edge solutions requiring ultra-low power consumption
Procurement Notes
Verify the specific suffix 'S' indicates mass production qualification level and 'C' denotes industrial temperature range compatibility. Confirm the 'VP' package type matches the required 15mm MAPBGA footprint. Ensure the silicon revision aligns with current errata documents before finalizing design-in decisions.
Selection Notes
Select this part when both high-performance application processing and efficient real-time control are required within a single chip. The inclusion of dedicated DSPs makes it suitable for always-on voice or sensor hub applications. Consider the available shared SRAM and external memory interface options when planning system architecture.
Part Context
This component is part of the i.MX 8ULP series, which utilizes NXP’s Energy Flex architecture. This design combines heterogeneous domain computing with specialized power management subsystems to deliver superior efficiency across various operational modes. The series targets energy-constrained environments where long battery life and immediate responsiveness are critical.
Replacement Considerations
MIMX8UD3DVP08SC
FAQ
What is the primary function of the PowerQuad co-processor?
The PowerQuad co-processor accelerates DSP functions, specifically handling fixed and floating-point arithmetic as well as Fast Fourier Transform (FFT) operations.
How does the EdgeLock secure enclave enhance system security?
It serves as the Root of Trust, featuring a dedicated boot ROM with Advanced High Assurance Boot (AHAB), ECDSA signature verification, and support for symmetric and asymmetric cryptographic acceleration.
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