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MIMX8US5DVP08SC
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Product Detailed Parameters
- Description：I.MX8ULP, SOLO 800MHZ
- Series：-
- Mfr：NXP USA Inc.
- Package：Tray
- Core Processor：-
- Number of Cores/Bus Width：-
- Speed：-
- Co-Processors/DSP：-
- RAM Controllers：-
- Graphics Acceleration：-
- Display & Interface Controllers：-
- Ethernet：-
- SATA：-
- USB：-
- Voltage - I/O：-
- Operating Temperature：-
- Security Features：-
- Mounting Type：Surface Mount
- Package / Case：485-LFBGA
- Supplier Device Package：485-LFBGA (15x15)
- Additional Interfaces：-
- Grade：-
- Qualification：-
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Overview
The MIMX8US5DVP08SC is an i.MX 8ULP System on Chip featuring dual Arm Cortex-A35 cores at 800 MHz and a Cortex-M33 core at 216 MHz. It integrates a Cadence Tensilica HiFi4 DSP, Fusion DSP, and 3D/2D GPU. The device supports LPDDR3/LPDDR4/LPDDR4X memory and includes EdgeLock secure enclave security. It operates within a temperature range of -40°C to +105°C and utilizes a 15x15 mm MAPBGA package with 0.5 mm pitch.
Feature Summary
- Heterogeneous multi-core architecture combining application processing with real-time control capabilities
- Integrated EdgeLock secure enclave providing hardware-based root of trust and cryptographic acceleration
- Specialized low-power audio and machine learning processing via dedicated DSPs
- Flexible connectivity options including Ethernet, CAN, USB, and MIPI interfaces
Applications
- Smart home appliances requiring ultra-low power consumption
- Industrial building automation systems
- Wearable devices with display and sensor integration
- Voice-controlled edge AI applications
Procurement Notes
Verify the specific suffix DVP against official NXP documentation to confirm package type and temperature grade. Ensure compatibility with required external memory interfaces and power management components. Cross-reference silicon revision details for any errata or design-specific constraints before finalizing procurement specifications.
Selection Notes
Select this component for designs prioritizing energy efficiency alongside rich graphical user interface rendering. The inclusion of both high-performance A35 cores and efficient M33 cores allows for complex OS execution alongside deterministic real-time tasks. Evaluate the integrated DSP capabilities if advanced audio or ML inference is required without external processors.
Part Context
This part belongs to the i.MX 8ULP family, designed for ultra-low-power edge computing. It differs from higher-performance i.MX 8M series by focusing on battery-operated and always-on applications. The ULP architecture emphasizes power gating and specialized accelerators for voice and sensor data processing.
Replacement Considerations
Consult NXP documentation for direct pin-to-pin or functional equivalents within the i.MX 8ULP series. Verify that alternative parts match the required package dimensions and thermal characteristics.
