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MIMX9301CVVXDABR
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Product Detailed Parameters
- Description：IC
- Series：i.MX 93
- Mfr：NXP USA Inc.
- Package：Tape & Reel (TR)
- Core Processor：ARM® Cortex®-A55, ARM® Cortex®-M33
- Number of Cores/Bus Width：1, 1 Core, 64-Bit
- Speed：900MHz, 250MHz
- Co-Processors/DSP：Multimedia; NEON™ MPE
- RAM Controllers：LPDDR4
- Graphics Acceleration：No
- Display & Interface Controllers：LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet：GBE (2)
- SATA：-
- USB：USB 2.0 (2)
- Voltage - I/O：1.8V
- Operating Temperature：-40°C ~ 105°C (TJ)
- Security Features：Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
- Mounting Type：Surface Mount
- Package / Case：306-LFBGA
- Supplier Device Package：306-LFBGA (11x11)
- Additional Interfaces：CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
- Grade：-
- Qualification：-
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Overview
The MIMX9301CVVXDABR is an NXP i.MX 93 series microprocessor featuring a single Arm Cortex-A55 core at 900MHz and one Cortex-M33 core at 250MHz. It utilizes a 306-LFBGA (11x11) package with 1.8V I/O voltage. The device supports LPDDR4 memory controllers and includes interfaces such as USB 2.0 OTG, Gigabit Ethernet, CANbus, SPI, I2C, UART, and SDIO. Operating temperature range is specified from -40°C to 105°C.
Feature Summary
- Integrates scalable Arm Cortex-A55 and Cortex-M33 cores for efficient edge computing
- Includes EdgeLock secure enclave for advanced security features like boot security and encryption
- Supports ML acceleration via Arm Ethos-U65 microNPU integration
- Provides rich peripheral connectivity including dual GbE and multiple serial interfaces
Applications
- Industrial IoT devices
- Automotive infotainment systems
- Smart home platforms
- Medical equipment
Procurement Notes
Verify the specific suffix 'BR' indicates tape-and-reel packaging when ordering. Confirm the 'C' designation aligns with the required commercial extended temperature range (-40°C to 105°C). Ensure compatibility with LPDDR4 external memory configurations. Cross-reference the exact part number against official NXP documentation to confirm pinout and electrical specifications before finalizing procurement.
Selection Notes
Select this model for applications requiring a balance of performance and power efficiency in edge computing scenarios. The single-core A55 configuration suits workloads that do not require multi-core parallel processing found in higher-tier i.MX 93 variants. Consider the 306-ball BGA package constraints for PCB layout. Verify that the integrated peripherals meet the specific interface requirements of the target system design.
Part Context
This component belongs to the NXP i.MX 93 family, designed for energy-efficient edge computing. It is part of the EdgeVerse portfolio, targeting automotive, industrial, and consumer IoT markets. The series emphasizes machine learning acceleration and high-level security through its integrated secure enclave architecture.
Replacement Considerations
MIMX9301CVVXDAC is a tray-packaged alternative within the same electrical specification family. MIMX9301DVVXDABR offers an extended industrial temperature range (-40°C to 125°C). Higher-performance variants include dual-core options such as the MIMX9331 series.
