MIMX9302DVVXDABR

MIMX9302DVVXDABR

$9.49
  • Description:IC
  • Series:i.MX 93
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:2eacaa92b9a5 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC
  • Series:i.MX 93
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Core Processor:ARM® Cortex®-A55, ARM® Cortex®-M33
  • Number of Cores/Bus Width:2, 1 Core, 64-Bit
  • Speed:900MHz, 250MHz
  • Co-Processors/DSP:Multimedia; NEON™ MPE
  • RAM Controllers:LPDDR4
  • Graphics Acceleration:No
  • Display & Interface Controllers:LCD, LVDS, MIPI-CSI, MIPI-DSI
  • Ethernet:GBE (2)
  • SATA:-
  • USB:USB 2.0 (2)
  • Voltage - I/O:1.8V
  • Operating Temperature:0°C ~ 95°C (TJ)
  • Security Features:Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
  • Mounting Type:Surface Mount
  • Package / Case:306-LFBGA
  • Supplier Device Package:306-LFBGA (11x11)
  • Additional Interfaces:CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
  • Grade:-
  • Qualification:-

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MIMX9302DVVXDABR

Overview

The MIMX9302DVVXDABR is a specialized application processor from the NXP i.MX 93 series, featuring dual Arm Cortex-A55 cores operating at a maximum frequency of 900 MHz. It utilizes a 64-bit data bus and includes 32 kB L1 instruction and data caches per core, alongside a 64 kB L2 cache. The device integrates 640 kB of data RAM and 256 kB of data ROM. Designed for automotive and industrial applications, it operates within a temperature range of 0°C to +95°C with a core voltage of 900 mV. The component is housed in an FCBGA-306 package.

Feature Summary

  • Dual-core Arm Cortex-A55 architecture optimized for high-efficiency edge computing tasks
  • Integrated EdgeLock secure enclave providing advanced hardware-based information security
  • Supports machine learning acceleration via integrated neural processing capabilities
  • Rich peripheral interface set including CAN, I2C, SPI, and USB for diverse connectivity

Applications

  • Automotive infotainment and telematics systems
  • Industrial automation controllers and gateways
  • Smart IoT edge devices requiring secure processing
  • Machine vision endpoints with ML inference needs

Procurement Notes

Verify the specific suffix DABR against the manufacturer's current datasheet to confirm package type and temperature grade. Ensure compatibility with required memory interfaces and power supply rails before integration. Confirm RoHS compliance status through official documentation. Check for any recent product change notices that may affect pinout or electrical characteristics. Validate availability through authorized distribution channels as stock levels vary.

Selection Notes

Select this model when dual-core performance at 900 MHz is sufficient for the target application workload. Consider the FCBGA-306 package constraints for PCB layout and thermal management. Evaluate if the 0°C to +95°C operating range meets environmental requirements; otherwise, explore extended temperature variants. Verify that the integrated peripherals satisfy connectivity needs without external bridge chips. Assess power budget against the 900 mV core voltage requirement.

Part Context

This processor belongs to the i.MX 93 family, designed for energy-efficient edge computing. It combines application processing with real-time control capabilities. The series emphasizes security and machine learning acceleration for industrial and automotive markets. It serves as a scalable solution for smart edge devices requiring robust connectivity and low power consumption.

Replacement Considerations

MIMX9301DVVXDABR offers single-core configuration. MIMX9302DVVXDAC provides tray packaging instead of reel. MIMX9322CVXXMAB supports extended industrial temperature ranges.

MIMX9302DVVXDABRMIMX9302DVVXDABR
$9.49
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