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Product Detailed Parameters
- Description:MIMX9331CVTXMAB
- Series:i.MX 93
- Mfr:NXP USA Inc.
- Package:Bulk
- Core Processor:ARM® Cortex®-A55, ARM® Cortex®-M33
- Number of Cores/Bus Width:2 Core, 64-Bit
- Speed:250MHz, 1.7GHz
- Co-Processors/DSP:Multimedia; NEON™ MPE
- RAM Controllers:LPDDR4
- Graphics Acceleration:No
- Display & Interface Controllers:LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:GBE (2)
- SATA:-
- USB:USB 2.0 (2)
- Voltage - I/O:1.8V
- Operating Temperature:-40°C ~ 105°C (TJ)
- Security Features:Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
- Mounting Type:Surface Mount
- Package / Case:306-LFBGA, FCBGA
- Supplier Device Package:306-FCBGA (14x14)
- Additional Interfaces:CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
- Grade:-
- Qualification:-
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Overview
The MIMX9331CVTXMAB is an industrial-grade i.MX 93 applications processor featuring dual Arm Cortex-A55 cores operating up to 1.7 GHz and a single Cortex-M33 core at 250 MHz. It utilizes a 14x14 mm, 0.65 mm pitch FCBGA306 package. The device supports LPDDR4/LPDDR4X memory with inline ECC up to 3.7 GT/s. Connectivity includes two Gigabit Ethernet controllers (one with TSN), two USB 2.0 interfaces, two CAN-FD modules, and extensive I/O such as eight LPUARTs, eight SPIs, and eight I2Cs. It integrates MIPI CSI-2 and DSI interfaces for camera and display connectivity.
Feature Summary
- Dual-core Arm Cortex-A55 processing platform with integrated NPU acceleration capabilities
- Industrial qualification supporting extended temperature ranges and robust security via EdgeLock secure enclave
- Rich peripheral set including dual Gigabit Ethernet with Time Sensitive Networking support
- Flexible multimedia interfaces supporting MIPI CSI-2 cameras and MIPI DSI displays
Applications
- Industrial human machine interface (HMI)
- Industrial vision systems
- EV Charging stations
- Industrial automation controllers
- Energy metering equipment
Procurement Notes
Verify the specific ordering suffix against the official NXP IMX93IEC data sheet to confirm package dimensions, silicon revision, and temperature grade. Ensure compatibility with required power management ICs for proper voltage sequencing. Confirm that the selected variant matches the intended application's thermal and performance requirements before finalizing procurement.
Selection Notes
Select this part for applications requiring industrial-grade reliability with high-performance computing. The dual A55 cores provide sufficient throughput for Linux-based edge applications. Verify that the 14x14 mm package fits the PCB layout constraints. Consider the available DDR bandwidth and peripheral count relative to system connectivity needs compared to other i.MX 93 derivatives.
Part Context
This component belongs to the i.MX 93 family of power-efficient applications processors designed for smart home, building control, and IoT edge devices. It represents NXP’s integration of scalable Arm Cortex-A55 cores with ML acceleration. The family targets automotive, industrial, and consumer IoT markets, offering various configurations in terms of core count, memory interfaces, and package sizes to suit diverse design requirements.
Replacement Considerations
Consult the i.MX 93 product selector guide for alternative parts within the same family. Substitutes may vary in core count, package size, or peripheral availability. Ensure any replacement maintains the required industrial temperature rating and pinout compatibility if board re-spin is not feasible.
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