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Product Detailed Parameters
- Description:IC
- Series:i.MX 93
- Mfr:NXP USA Inc.
- Package:Tape & Reel (TR)
- Core Processor:ARM® Cortex®-A55, ARM® Cortex®-M33
- Number of Cores/Bus Width:2 Core, 64-Bit
- Speed:250MHz, 1.7GHz
- Co-Processors/DSP:Multimedia; NEON™ MPE
- RAM Controllers:LPDDR4
- Graphics Acceleration:No
- Display & Interface Controllers:LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:GBE (2)
- SATA:-
- USB:USB 2.0 (2)
- Voltage - I/O:1.8V
- Operating Temperature:0°C ~ 95°C (TJ)
- Security Features:Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
- Mounting Type:Surface Mount
- Package / Case:306-LFBGA
- Supplier Device Package:306-LFBGA (11x11)
- Additional Interfaces:CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
- Grade:-
- Qualification:-
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Overview
The MIMX9331DVVXMABR is a specialized application processor from the NXP i.MX 93 series, designed for energy-efficient edge computing in automotive and industrial sectors. It integrates one Arm Cortex-A55 core operating at up to 1.7 GHz with an Arm Cortex-M33 core running at 250 MHz. The device features a 64-bit data bus width and includes an Arm Ethos-U65 microNPU for machine learning acceleration. Key specifications include 32 kB L1 instruction and data caches per A55 core, 64 kB L2 cache, and support for LPDDR4/LPDDR4X memory interfaces. It operates within a temperature range of 0°C to +95°C and utilizes a 306-ball FCBGA package.
Feature Summary
- Integrates scalable Arm Cortex-A55 cores with an Arm Ethos-U65 microNPU for efficient machine learning acceleration.
- Includes EdgeLock secure enclave providing advanced security features such as boot security, encryption, and tamper detection.
- Supports rich peripheral connectivity including dual USB 2.0 Type-C, dual Gigabit Ethernet with AVB/IEEE 1588, and multiple CAN FD interfaces.
- Built on NXP Energy Flex architecture to optimize performance and power efficiency for industrial and automotive applications.
Applications
- Automotive infotainment and gateway systems
- Industrial automation controllers and sensors
- Edge AI and machine learning inference devices
Procurement Notes
Verify the specific suffix 'BR' against the official NXP datasheet to confirm tape-and-reel packaging status and any distinct qualification levels. Ensure compatibility with required operating temperature ranges, as this variant specifies 0°C to +95°C. Cross-reference the full part number with NXP's product longevity program documentation to confirm long-term availability commitments for your production timeline.
Selection Notes
Select this component when a single high-performance A55 core combined with a real-time M33 core is sufficient for the application workload. It is suitable for designs requiring integrated ML acceleration via the Ethos-U65 without the need for dual A55 cores found in higher-tier i.MX 93 models. Consider the 306-ball FCBGA package constraints and the specific 0-95°C commercial/industrial temperature rating during PCB layout and thermal management planning.
Part Context
This processor belongs to the i.MX 93 family, which represents NXP's entry into the intelligent edge market with integrated AI capabilities. The series is part of the EdgeVerse portfolio, offering solutions for consumer, industrial, and automotive segments. The MIMX9331DVVXMABR specifically targets applications needing robust security and moderate processing power with low latency, leveraging the first integration of scalable Cortex-A55 cores in the i.MX line.
Replacement Considerations
Direct substitutes within the i.MX 93 family include MIMX9331CVVXMABR (Commercial temp) or MIMX9331XVVXMABR (Extended temp). Verify pin-to-pin compatibility and software driver support when migrating between these variants, as differences primarily lie in temperature ratings and qualification standards rather than functional architecture.
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