— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC
- Series:i.MX 93
- Mfr:NXP USA Inc.
- Package:Tape & Reel (TR)
- Core Processor:ARM® Cortex®-A55, ARM® Cortex®-M33
- Number of Cores/Bus Width:2 Core, 64-Bit
- Speed:250MHz, 1.7GHz
- Co-Processors/DSP:Multimedia; NEON™ MPE
- RAM Controllers:LPDDR4
- Graphics Acceleration:No
- Display & Interface Controllers:LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:GBE (2)
- SATA:-
- USB:USB 2.0 (2)
- Voltage - I/O:1.8V
- Operating Temperature:-40°C ~ 125°C (TJ)
- Security Features:Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
- Mounting Type:Surface Mount
- Package / Case:306-LFBGA
- Supplier Device Package:306-LFBGA (11x11)
- Additional Interfaces:CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
- Grade:-
- Qualification:-
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Overview
The MIMX9331XVVXMABR is a specialized application processor from the NXP i.MX 93 series, featuring a dual-core architecture with two ARM Cortex-A55 cores operating at up to 1.7 GHz and an ARM Cortex-M33 core running at 250 MHz. It integrates an Arm Ethos-U65 microNPU for machine learning acceleration and includes EdgeLock secure enclave features. The device supports LPDDR4/LPDDR4X memory interfaces with inline ECC and offers extensive connectivity options including dual USB 2.0 Type-C, dual Gigabit Ethernet with AVB/IEEE 1588, and multiple serial interfaces. It operates within a temperature range of -40°C to +125°C.
Feature Summary
- Integrates Arm Ethos-U65 microNPU for efficient edge machine learning processing alongside multicore CPU capabilities.
- Provides hardware-based security through EdgeLock secure enclave, supporting boot security, encryption, and tamper detection.
- Features high-speed multimedia interfaces including MIPI-CSI and MIPI-DSI for camera input and display output.
- Supports advanced automotive networking protocols such as AVB, IEEE 1588, and TSN via dual Gigabit Ethernet ports.
Applications
- Automotive infotainment and instrument cluster systems
- Industrial IoT gateways and edge computing nodes
- Smart home hubs and consumer electronics
- Machine vision and camera processing modules
Procurement Notes
Verify the specific suffix 'R' indicates tape-and-reel packaging when ordering. Confirm the exact frequency grade and memory configuration required for your design against the official datasheet specifications. Ensure compatibility with the selected LPDDR4/LPDDR4X components listed in the NXP memory compatibility guide. Check for any recent product change notices that might affect pinout or electrical characteristics before finalizing the bill of materials.
Selection Notes
Select this component when both high-performance application processing and real-time control are required in a single SoC. The inclusion of the microNPU makes it suitable for applications requiring on-device AI inference without external accelerators. Consider the thermal requirements carefully due to the extended industrial and automotive temperature ranges. Evaluate the available GPIO and peripheral counts against system interface needs to ensure optimal resource utilization.
Part Context
This part belongs to the i.MX 93 family, which is designed for energy-efficient edge computing. It represents a shift towards integrating neural processing units into standard application processors. The series targets markets demanding robust security and multimedia capabilities while maintaining low power consumption. It serves as a bridge between traditional microcontrollers and high-end application processors.
Replacement Considerations
Check the i.MX 93 family list for variants with different package sizes or memory controllers. Substitutes may include parts with lower clock speeds or reduced peripheral counts if cost is a primary driver. Ensure any replacement maintains the same core architecture for software compatibility. Verify that the new part supports the required operating temperature range and security features.
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