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Product Detailed Parameters
- Description:IC
- Series:i.MX 93
- Mfr:NXP USA Inc.
- Package:Tape & Reel (TR)
- Core Processor:ARM® Cortex®-A55, ARM® Cortex®-M33
- Number of Cores/Bus Width:2, 1 Core, 64-Bit
- Speed:250MHz, 1.7GHz
- Co-Processors/DSP:Multimedia; NEON™ MPE
- RAM Controllers:LPDDR4
- Graphics Acceleration:No
- Display & Interface Controllers:LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:GBE (2)
- SATA:-
- USB:USB 2.0 (2)
- Voltage - I/O:1.8V
- Operating Temperature:0°C ~ 95°C (TJ)
- Security Features:Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
- Mounting Type:Surface Mount
- Package / Case:306-LFBGA
- Supplier Device Package:306-LFBGA (11x11)
- Additional Interfaces:CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
- Grade:-
- Qualification:-
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Overview
The MIMX9332DVVXMABR is an NXP Semiconductors application processor belonging to the i.MX 93 series. It features a dual-core ARM Cortex-A55 architecture with a maximum clock frequency of 1.7 GHz and a 64-bit data bus width. The device integrates an ARM Cortex-M33 core operating at 250 MHz for real-time tasks. Key specifications include 32 kB L1 instruction and data caches per core, 64 kB L2 cache, 640 kB data RAM, and 256 kB data ROM. It operates on a 900 mV supply voltage within a temperature range of 0°C to +95°C. The component utilizes an FCBGA-306 package.
Feature Summary
- Integrates dual-core ARM Cortex-A55 processors for high-performance edge computing applications
- Includes dedicated ARM Cortex-M33 core for low-power real-time control tasks
- Provides extensive connectivity options including USB, Ethernet, CAN FD, and multiple serial interfaces
Applications
- Automotive systems requiring robust processing capabilities
- Industrial automation and control equipment
- IoT devices demanding efficient edge computing performance
Procurement Notes
Verify the specific suffix 'BR' against official NXP documentation to confirm reel packaging requirements and any functional distinctions from non-reel variants. Ensure compatibility with the required operating temperature range of 0°C to +95°C for your specific deployment environment. Cross-reference the FCBGA-306 footprint dimensions during PCB layout design to prevent mechanical mismatches. Confirm RoHS compliance status through current manufacturer declarations before finalizing procurement.
Selection Notes
Select this model when a dual-core A55 configuration is required alongside a dedicated M33 real-time core. The FCBGA-306 package offers higher pin density compared to smaller variants in the i.MX 93 family. Consider this part for automotive or industrial sectors where the specified commercial temperature range meets operational needs. Evaluate memory requirements against the integrated 640 kB RAM and 256 kB ROM limits.
Part Context
This processor is part of the i.MX 93 family, designed for energy-efficient edge computing with machine learning acceleration support. The series targets automotive, industrial, and consumer IoT markets. It serves as a scalable solution within NXP's EdgeVerse portfolio, offering various qualification levels and package options to suit different performance and environmental constraints across embedded applications.
Replacement Considerations
Consult official substitution lists for compatible i.MX 93 variants. Verify pin-to-pin compatibility if considering alternative packages like FCBGA-208. Ensure software drivers support the specific silicon revision and feature set differences between models.
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