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Product Detailed Parameters
- Description:IC
- Series:i.MX 93
- Mfr:NXP USA Inc.
- Package:Tape & Reel (TR)
- Core Processor:ARM® Cortex®-A55, ARM® Cortex®-M33
- Number of Cores/Bus Width:2, 1 Core, 64-Bit
- Speed:250MHz, 1.7GHz
- Co-Processors/DSP:Multimedia; NEON™ MPE
- RAM Controllers:LPDDR4
- Graphics Acceleration:No
- Display & Interface Controllers:LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:GBE (2)
- SATA:-
- USB:USB 2.0 (2)
- Voltage - I/O:1.8V
- Operating Temperature:-40°C ~ 125°C (TJ)
- Security Features:Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
- Mounting Type:Surface Mount
- Package / Case:306-LFBGA
- Supplier Device Package:306-LFBGA (11x11)
- Additional Interfaces:CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
- Grade:-
- Qualification:-
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Overview
The MIMX9332XVVXMABR is an application processor from the NXP i.MX 93 series, designed for high-efficiency edge computing and machine learning acceleration. It features a dual-core ARM Cortex-A55 architecture with a maximum clock frequency of 1.7 GHz and includes an integrated ARM Ethos-U65 microNPU for neural network processing. The device incorporates a secondary ARM Cortex-M33 core operating at 250 MHz for real-time tasks. It supports up to 3.7 GT/s LPDDR4/LPDDR4X memory via a 16-bit bus with inline ECC. Key interfaces include two USB 2.0 Type-C ports, dual Gigabit Ethernet controllers supporting AVB and IEEE 1588, and multiple serial communication peripherals such as CAN FD, UART, I2C, and SPI.
Feature Summary
- Integrates a dual-core ARM Cortex-A55 CPU cluster with an embedded Arm Ethos-U65 microNPU for efficient on-device machine learning inference.
- Provides robust connectivity through dual Gigabit Ethernet interfaces with Time-Sensitive Networking (TSN) support and dual USB 2.0 Type-C ports.
- Includes an EdgeLock Secure Enclave subsystem to ensure hardware-based security, secure boot, and tamper detection capabilities.
- Features comprehensive display and camera interfaces, including MIPI DSI and MIPI CSI-2, alongside extensive peripheral options like FlexIO and ADC.
Applications
- Industrial Human-Machine Interfaces (HMI)
- Automotive infotainment and instrument clusters
- Smart home and IoT gateways
- Machine vision systems
Procurement Notes
Verify the specific suffix 'BR' indicates tape-and-reel packaging configuration when sourcing. Confirm the exact temperature grade and silicon revision against the latest NXP datasheet, as variants within the i.MX 93 family may differ in thermal ratings or pin compatibility. Ensure supply chain authenticity through authorized distributors to avoid counterfeit components.
Selection Notes
Select this model for applications requiring balanced performance between general-purpose processing and AI acceleration. The dual-core A55 configuration suits moderate computational loads, while the M33 core handles low-power background tasks. Consider the FCBGA-306 package size for PCB layout constraints and verify LPDDR4/LPDDR4X memory compatibility using NXP's official memory qualification lists.
Part Context
This component belongs to the i.MX 93 family, which targets industrial, automotive, and consumer IoT markets. It represents NXP's strategy for power-efficient edge intelligence, combining standard ARM cores with specialized accelerators. The series emphasizes security and connectivity, positioning it as a versatile solution for smart devices requiring reliable operation in varied environments.
Replacement Considerations
Check for other i.MX 93 variants with different core counts or package sizes if system requirements change. Verify pin-to-pin compatibility before substituting with other BGA packages in the same family.
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