— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC
- Series:i.MX 93
- Mfr:NXP USA Inc.
- Package:Tape & Reel (TR)
- Core Processor:ARM® Cortex®-A55, ARM® Cortex®-M33
- Number of Cores/Bus Width:2, 1 Core, 64-Bit
- Speed:250MHz, 1.7GHz
- Co-Processors/DSP:Multimedia; NEON™ MPE, NPU
- RAM Controllers:LPDDR4
- Graphics Acceleration:No
- Display & Interface Controllers:LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:GBE (2)
- SATA:-
- USB:USB 2.0 (2)
- Voltage - I/O:1.8V
- Operating Temperature:-40°C ~ 105°C (TJ)
- Security Features:Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
- Mounting Type:Surface Mount
- Package / Case:306-LFBGA
- Supplier Device Package:306-LFBGA (11x11)
- Additional Interfaces:CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
- Grade:-
- Qualification:-
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Overview
The MIMX9352CVVXMABR is a microprocessor from the NXP i.MX 93 family, designed for energy-efficient edge computing. It features a heterogeneous multi-core architecture integrating two Arm Cortex-A55 application cores and one Arm Cortex-M33 real-time core. The device includes an Arm Ethos-U65 microNPU for machine learning acceleration and an EdgeLock secure enclave for advanced security. It supports high-speed external memory interfaces and offers extensive connectivity options suitable for industrial and automotive applications.
Feature Summary
- Heterogeneous multicore processing with dual Cortex-A55 and single Cortex-M33 cores
- Integrated Arm Ethos-U65 microNPU for efficient machine learning inference
- EdgeLock secure enclave providing hardware-based security and tamper detection
- Rich peripheral set including Gigabit Ethernet, CAN FD, and MIPI display interfaces
Applications
- Industrial automation controllers
- Automotive infotainment and gateway systems
- Smart IoT edge devices
- Consumer electronics with AI capabilities
Procurement Notes
Verify the specific suffix 'R' indicates tape-and-reel packaging when sourcing. Confirm the operating temperature range matches the target environment, as automotive variants may differ from commercial ones. Ensure compatibility with the required power management ICs and memory configurations during the design-in phase.
Selection Notes
Select this component for designs requiring balanced performance between Linux-based application processing and real-time control tasks. The integrated NPU makes it suitable for vision or audio processing at the edge. Consider the FCCSP package size and pin count against board space constraints and I/O requirements.
Part Context
This part belongs to the i.MX 93 series, which utilizes NXP's Energy Flex architecture. It is positioned as a scalable MPU for edge devices, offering improved power efficiency compared to previous generations while supporting modern connectivity standards like TSN and CAN FD for networked environments.
Replacement Considerations
Check for other i.MX 93 variants such as MIMX9352CVVXMAB if reel packaging is not required. Verify pin-to-pin compatibility with existing designs before switching to different package options within the same family.
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