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MIMXRT117TDVMAB
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Product Detailed Parameters
- Description：IC
- Series：-
- Mfr：NXP USA Inc.
- Package：Tray
- Core Processor：-
- Number of Cores/Bus Width：-
- Speed：-
- Co-Processors/DSP：-
- RAM Controllers：-
- Graphics Acceleration：-
- Display & Interface Controllers：-
- Ethernet：-
- SATA：-
- USB：-
- Voltage - I/O：-
- Operating Temperature：-
- Security Features：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
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- Grade：-
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Overview
The MIMXRT117TDVMAB is an ARM microcontroller within the i.MX RT1170 series, designed for high-performance real-time applications. It integrates a dual-core architecture featuring an Arm Cortex-M7 processor running at up to 1 GHz and an Arm Cortex-M4 processor operating at up to 400 MHz. The device includes 2 MB of on-chip SRAM, comprising dedicated Tightly Coupled Memory (TCM) for both cores. It supports advanced connectivity options such as Time-Sensitive Networking (TSN) and Audio Video Bridging (AVB) via multiple Ethernet interfaces, alongside standard peripherals like CAN-FD, USB, and SPI.
Feature Summary
- Dual-core processing capability with high-frequency Cortex-M7 and Cortex-M4 execution units
- Integrated security features including secure boot and encryption engines under EdgeLock Assurance
- Support for Time-Sensitive Networking and Audio Video Bridging protocols
- Comprehensive peripheral set including multiple CAN-FD and high-speed serial interfaces
Applications
- Automotive infotainment and instrument clusters
- Industrial automation controllers
- Internet of Things (IoT) gateways
Procurement Notes
Verify the specific suffix 'AB' against official NXP documentation to confirm pinout compatibility and feature set alignment. Ensure that the selected package variant matches the target PCB footprint requirements. Cross-reference the manufacturing date code and lot information to verify component authenticity and supply chain integrity before integration into production designs.
Selection Notes
Select this component when design requirements demand deterministic real-time performance combined with rich multimedia or networking capabilities. The dual-core separation allows for partitioning safety-critical tasks on the M4 core while handling complex user interfaces or protocol stacks on the M7 core. Evaluate thermal management solutions suitable for the BGA-1313 package given the high clock speeds involved in sustained operation.
Part Context
This part belongs to the i.MX RT1170 crossover MCU family, which bridges the gap between application processors and traditional microcontrollers. The series is characterized by its ability to execute complex operating systems while maintaining microcontroller-level latency and determinism. It is supported by the MCUXpresso ecosystem, providing extensive software development kits and configuration tools for rapid deployment.
Replacement Considerations
Consult official NXP substitution guides for verified alternatives. Potential candidates within the same family include variants with different memory configurations or package types, provided they maintain compatible pinouts and electrical specifications.
