MIMXRT1181CVP2B

MIMXRT1181CVP2B

$8.03
  • Description:MIMXRT1181CVP2B
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Bulk

SKU:518594c37d35 Category: Brand:

  
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Product Detailed Parameters

  • Description:MIMXRT1181CVP2B
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Bulk
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MIMXRT1181CVP2B

Overview

The NXP MIMXRT1181CVP2B is a crossover MCU featuring an Arm Cortex-M7 core at 800 MHz and a Cortex-M33 core at 300 MHz. It includes 256 KB of TCM for the M33, 1 MB of OCRAM with ECC, and 82 GPIOs. The device integrates a 2+1 port TSN switch supporting up to 3 Gbps throughput and two EtherCAT SubDevice ports. Connectivity comprises three CAN-FD interfaces, six LPSPI ports, twelve UARTs, and two USB 2.0 OTG controllers with PHYs. It operates within an industrial temperature range.

Feature Summary

  • Dual-core architecture combining high-performance processing with deterministic real-time control capabilities
  • Integrated Gigabit Time Sensitive Networking (TSN) switch enabling multi-protocol industrial communication
  • Advanced security subsystem including EdgeLock Secure Enclave and Physical Unclonable Function (PUF)
  • High-speed analog peripherals including 16-bit ADCs and Delta-Sigma demodulators for motor control

Applications

  • Industrial control systems
  • Compact motion control applications
  • Industrial networking and gateways
  • AC and servo drives
  • In-vehicle networking

Procurement Notes

Verify the specific suffix against official documentation to confirm package type, temperature grade, and mass storage options. Ensure compatibility with MCUXpresso SDK versions for the i.MX RT1181 variant. Confirm pinout alignment with target PCB designs due to the 144-pin BGA configuration. Validate power supply requirements for the integrated DC-DC and LDO regulators.

Selection Notes

Select this model when dual-core performance is required alongside integrated TSN switching without external PHYs. The 1 MB OCRAM and limited TCM distinguish it from higher-capacity family members. Ideal for cost-sensitive industrial nodes requiring EtherCAT sub-device functionality. Evaluate thermal management needs for the 144-ball BGA package in enclosed environments.

Part Context

Part of the i.MX RT1180 crossover MCU family designed for Industry 4.0 applications. It bridges existing systems with future protocols using integrated TSN technology. The device supports scalable host-companion communication up to 1 Gbps. It targets efficiency with low-power operation starting from 250 mW in industrial environments.

Replacement Considerations

MIMXRT1182CVP2B offers similar connectivity but lacks the Cortex-M7 core. MIMXRT1186CVJ8C provides increased GPIO count and a different package. MIMXRT1187KVM8C adds the Cortex-M7 core and larger memory resources.

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$8.03
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